发明授权
- 专利标题: Via structure to improve routing of wires within an integrated circuit
- 专利标题(中): 通过结构改善集成电路内导线的布线
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申请号: US12181374申请日: 2008-07-29
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公开(公告)号: US07962881B2公开(公告)日: 2011-06-14
- 发明人: Markus T. Buehler , Ankit Gangwar , Juergen Koehl , Arun K. Mishra
- 申请人: Markus T. Buehler , Ankit Gangwar , Juergen Koehl , Arun K. Mishra
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Cantor Colburn LLP
- 代理商 Yuanmin Cai
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
In consideration for the fact that a connection on the upper layers of an integrated circuit needs to access a lower layer to connect to, e.g., a transistor, at least one via on each layer is required below the top layer used by a connection for each pin. The vias (i.e., the connection structures between wiring planes within an integrated circuit) are arranged such that the number of wiring resources blocked on the lower layers is reduced. Various rules govern which vias are chosen. The main characteristic is to elect only a certain number of wiring channels appropriate for the vias on a single layer and then apply an optimization within the restricted elected wiring channels on that layer to select the most appropriate vias.
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