发明授权
US07965509B2 High performance dual-in-line memory (DIMM) array liquid cooling assembly and method
有权
高性能双列直插式存储器(DIMM)阵列液体冷却组件及方法
- 专利标题: High performance dual-in-line memory (DIMM) array liquid cooling assembly and method
- 专利标题(中): 高性能双列直插式存储器(DIMM)阵列液体冷却组件及方法
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申请号: US12418973申请日: 2009-04-06
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公开(公告)号: US07965509B2公开(公告)日: 2011-06-21
- 发明人: Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Maurice F. Holahan , Madhusudan K. Iyengar , Robert E. Simons , Rebecca N. Wagner
- 申请人: Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Maurice F. Holahan , Madhusudan K. Iyengar , Robert E. Simons , Rebecca N. Wagner
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Heslin Rothenberg Farley & Mesiti P.C.
- 代理商 Dennis Jung, Esq.; Kevin P. Radigan, Esq.
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit.
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