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1.发明授权Flux-free detachable thermal interface between an integrated circuit device and a heat sink 失效集成电路器件和散热器之间的无磁通可拆卸热接口公开(公告)号：US08289712B2
公开(公告)日：2012-10-16
申请号：US12819753
申请日：2010-06-21
申请人： Maurice F Holahan , Eric Vance Kline , Paul N Krystek , Michael R Rasmussen , Arvind K Sinha , Stephen M Zins
发明人： Maurice F Holahan , Eric Vance Kline , Paul N Krystek , Michael R Rasmussen , Arvind K Sinha , Stephen M Zins
IPC分类号： H05K7/20
CPC分类号： H05K7/20472 , H01L23/433 , H01L2924/0002 , Y10T29/49128 , H01L2924/00
摘要： A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached frame member horizontally enclosing the compressible member.
摘要翻译： 在安装的集成电路器件和散热器之间的无热流材料的导热接口，其包括安装的集成电路器件，垂直设置在器件上的散热器，不可靠地设置在器件和热量之间的可垂直压缩的导热部件 水槽和水平地包围可压缩构件的未连接的框架构件。
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公开(公告)号：US20110303403A1
公开(公告)日：2011-12-15
申请号：US12814175
申请日：2010-06-11
申请人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
发明人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
CPC分类号： H01L23/4332 , F28F3/12 , F28F2255/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： An embodiment of the invention comprises a method for constructing a heat exchanger for cooling one or more semiconductor components. The method comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber. Channel segments are configured along the interior side of the first sheet, wherein each channel extends between the coolant chambers and two TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.
摘要翻译： 本发明的实施例包括一种用于构造用于冷却一个或多个半导体部件的热交换器的方法。 该方法包括提供特定导热金属箔的第一和第二平面片的步骤，其中每个片具有外侧和内侧。 该方法还包括在第一片材中形成一个或多个热接触节点（TCN），其中每个TCN从第一片材的外侧向外延伸，并且包括平面接触构件和一个或多个侧面部分，侧面部分 包括能够使TCN的接触构件朝向和远离第一板的外侧移动的弹性部件，以及TCN的侧部和接触部件共同形成冷却剂室。 通道段沿着第一片材的内侧配置，其中每个通道选择性地在冷却剂室和两个TCN之间或TCN的冷却剂室与输入端口或输出端口之间延伸。 该方法还包括将第二片材的内侧连接到第一片材的内侧，以便形成包括每个通道段的密封流动路径，并且使液体冷却剂能够流入和流出每个通道段的冷却剂室 TCN。
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3.发明授权Method and apparatus for a low impedance anti-recirculation air moving inlet device 失效低阻抗再循环空气移动入口装置的方法和装置公开(公告)号：US08388423B2
公开(公告)日：2013-03-05
申请号：US12170940
申请日：2008-07-10
CPC分类号： H05K7/2019
摘要： An inlet recirculation apparatus for an air moving device includes a housing defined by a wall extending from a base. The base includes an aperture therethrough receptive to alignment with an inlet of the air moving device. A plurality of flaps each pivotally extends radially outwardly from a center pivot to another corresponding pivot disposed around a perimeter of the wall. The center pivot is coaxial with a center of the aperture. Each flap moves to an open position due to air pressure from the air moving device causing air to flow into the inlet wherein each flap pivotally rotates about the center pivot and corresponding pivot at the wall, and moves to a closed position when air pressure from the air moving device ceases wherein a space between contiguous flaps is eliminated when each flap pivotally rotates to the closed position about the center pivot and corresponding pivot at the wall to prevent reverse airflow through the air moving device.
摘要翻译： 用于空气移动装置的入口再循环装置包括由从基座延伸的壁限定的壳体。 底座包括一个穿过其的孔，该孔穿过空气移动装置的入口对准。 多个翼片各自枢转地从中心枢轴径向向外延伸到围绕壁的周边设置的另一对应的枢轴。 中心枢轴与孔的中心同轴。 由于来自空气移动装置的空气压力，每个翼片移动到打开位置，导致空气流入入口，其中每个翼片围绕中心枢轴和在壁处的相应枢轴枢转地旋转，并且当来自 空气移动装置停止，其中当每个翼片围绕中心枢轴转动到关闭位置时在相邻翼片之间的空间被消除，并且在壁处具有相应的枢轴以防止通过空气移动装置的反向气流。
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公开(公告)号：US07352575B2
公开(公告)日：2008-04-01
申请号：US11461250
申请日：2006-07-31
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20727
摘要： Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.
摘要翻译： 公开了一种动态空气移动系统，其包括设置在电子外壳中的轨道系统，至少一个风扇壳体，其可移动地设置在轨道系统上，风扇可沿轨道系统致动，可枢转风扇设置在每个至少一个风扇 壳体，包括在风扇中的至少一个叶片，所述至少一个叶片可围绕至少一个叶片轴线旋转;风扇控制器芯片，其控制至少一个风扇壳体的致动，至少一个叶片的单独旋转， 风扇，设置在位于电子外壳中的至少一个芯片上的芯片热传感器，热传感器连接到风扇控制器芯片，以及设置在与电子外壳相关联的至少一个磁盘驱动器上的驱动热传感器，驱动热 传感器连接到风扇控制器芯片。
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公开(公告)号：US5027254A
公开(公告)日：1991-06-25
申请号：US434963
申请日：1989-11-09
申请人： William D. Corfits , Maurice F. Holahan , Susan J. Martino , David R. Motschman , James R. Thorpe
发明人： William D. Corfits , Maurice F. Holahan , Susan J. Martino , David R. Motschman , James R. Thorpe
CPC分类号： H05K7/1424 , G06F1/20
摘要： A side-by-side double row of electronics packages plug into a common backplane. Cooling air flows in an (upside down) omega-shaped path turning into one row of packages, flowing through that row, turning through an air-moving device into a plenum chamber, then turning into the second row of packages, and out of the second row turning again to an outlet.
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公开(公告)号：US20120138269A1
公开(公告)日：2012-06-07
申请号：US12959477
申请日：2010-12-03
申请人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
发明人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
IPC分类号： F28D15/00
CPC分类号： F28D15/00 , F04D13/024 , F04D29/586 , F28F2250/08 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.
摘要翻译： 公开了一种用于冷却电热源的方法和系统。 热交换器具有两个主要子组件。 通过设置在热源旁边的第二子组件提供闭环流体流。 通过与第二子组件连通的第一子组件提供开环流体流。 第一和第二子组件中的每一个具有旋转元件。 进入第一子组件的流体流使第一旋转元件旋转，并且旋转元件之间的磁连通引起第二旋转元件的移动，从而实现第二子组件内的流体运动。 操作上，闭环子组件从热源移除热量并将其传送到开环子组件，以便在下游流体流中进行随后的热传递。
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公开(公告)号：US20080024983A1
公开(公告)日：2008-01-31
申请号：US11461250
申请日：2006-07-31
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20727
摘要： Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.
摘要翻译： 公开了一种动态空气移动系统，其包括设置在电子外壳中的轨道系统，至少一个风扇壳体，其可移动地设置在轨道系统上，风扇可沿轨道系统致动，可枢转风扇设置在每个至少一个风扇 壳体，包括在风扇中的至少一个叶片，所述至少一个叶片可围绕至少一个叶片轴线旋转;风扇控制器芯片，其控制至少一个风扇壳体的致动，至少一个叶片的单独旋转， 风扇，设置在位于电子外壳中的至少一个芯片上的芯片热传感器，热传感器连接到风扇控制器芯片，以及设置在与电子外壳相关联的至少一个磁盘驱动器上的驱动热传感器，驱动热 传感器连接到风扇控制器芯片。
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8.发明授权High performance dual-in-line memory (DIMM) array liquid cooling assembly and method 有权高性能双列直插式存储器（DIMM）阵列液体冷却组件及方法公开(公告)号：US07965509B2
公开(公告)日：2011-06-21
申请号：US12418973
申请日：2009-04-06
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Maurice F. Holahan , Madhusudan K. Iyengar , Robert E. Simons , Rebecca N. Wagner
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Maurice F. Holahan , Madhusudan K. Iyengar , Robert E. Simons , Rebecca N. Wagner
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F9/0275 , H01L2924/0002 , H05K7/20772 , H05K7/20781 , H01L2924/00
摘要： A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coupling to the heat generating components including the DIMM array(s). The first plate side has a coolant conduit connected at one end to a supply manifold via flexible tubing and at another end to a return manifold via another flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through said first plate's conduit.
摘要翻译： 提供了一种用于冷却包括双列直插存储器（DIMM）阵列的计算机的电子发热部件的方法和相关组件。 组件包括具有第一和第二（反向）侧的板的冷却部件，热耦合到包括DIMM阵列的发热部件。 第一板侧具有冷却剂导管，其一端通过柔性管连接到供应歧管，另一端通过另一柔性管连接到回流歧管，使得当供应冷却剂时，冷却剂通过供应歧管循环到回流歧管 穿过所述第一板的导管。
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公开(公告)号：US20110137621A1
公开(公告)日：2011-06-09
申请号：US12631110
申请日：2009-12-04
CPC分类号： F04D27/001 , F04D25/16 , F04D29/663
摘要： In embodiments of the present invention a method and computer program product is presented to map noise levels onto a fan's hydraulic operating plane. In another embodiment this methodology allows for the comparison of a first fan configuration to a second fan configuration to enable the selection of a particular fan configuration to be utilized in an electronic system.
摘要翻译： 在本发明的实施例中，呈现方法和计算机程序产品以将噪声水平映射到风扇的液压操作平面上。 在另一个实施例中，该方法允许将第一风扇配置与第二风扇配置进行比较，以使得能够选择在电子系统中使用特定的风扇配置。
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公开(公告)号：US07909902B2
公开(公告)日：2011-03-22
申请号：US12138286
申请日：2008-06-12
申请人： Eric A. Eckberg , James D. Gerken , Maurice F. Holahan , Gerard F. Muenkel , Joseph D. Rico , H. Burt Stone
发明人： Eric A. Eckberg , James D. Gerken , Maurice F. Holahan , Gerard F. Muenkel , Joseph D. Rico , H. Burt Stone
CPC分类号： B01D46/10 , B01D2257/80 , B01D2259/455 , B01D2259/4591 , B01D2279/45 , Y10T29/49995 , Y10T428/24165
摘要： Described herein are various embodiments of a modified hexagonal perforated pattern and objects within which the pattern is formed. For example, according to one representative embodiment, an apparatus includes an object and a perforated pattern formed in the object. The perforated pattern includes a plurality of perforations through which matter is flowable. Each of the perforations includes a modified hexagonal shape including a hexagon having six rounded corners.
摘要翻译： 这里描述了改进的六边形穿孔图案和其中形成图案的物体的各种实施例。 例如，根据一个代表性实施例，一种装置包括形成在物体中的物体和穿孔图案。 穿孔图案包括多个穿孔，物质可通过其穿过。 每个穿孔包括改进的六边形形状，包括具有六个圆角的六边形。
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