Invention Grant
- Patent Title: Repair soldering method for repairing a component which comprises a base material with an oriented microstructure
- Patent Title (中): 用于修复包括具有取向微结构的基材的部件的修补焊接方法
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Application No.: US10588024Application Date: 2005-01-28
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Publication No.: US07967183B2Publication Date: 2011-06-28
- Inventor: Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
- Applicant: Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
- Applicant Address: DE Munich DE Munich
- Assignee: Siemens Aktiengesellschaft,MTU Aero Engines GmbH
- Current Assignee: Siemens Aktiengesellschaft,MTU Aero Engines GmbH
- Current Assignee Address: DE Munich DE Munich
- Priority: EP04002332 20040203
- International Application: PCT/EP2005/000884 WO 20050128
- International Announcement: WO2005/075136 WO 20050818
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.
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