公开(公告)号：US20070228108A1

公开(公告)日：2007-10-04

申请号：US10588024

申请日：2005-01-28

申请人： Dirk Goldschmidt ,  Matthias Oechsner ,  Michael Ott ,  Uwe Paul ,  Ursula Pickert ,  Eckart Schumann ,  Beate Seiler ,  Robert Singer ,  Jan Steinbach ,  Andreas Volek ,  Volker Vosberg

发明人： Dirk Goldschmidt ,  Matthias Oechsner ,  Michael Ott ,  Uwe Paul ,  Ursula Pickert ,  Eckart Schumann ,  Beate Seiler ,  Robert Singer ,  Jan Steinbach ,  Andreas Volek ,  Volker Vosberg

IPC分类号： B23K31/02

CPC分类号： F01D5/005 ,  B23K1/0008 ,  B23K1/0018 ,  B23K1/002 ,  B23K1/005 ,  B23K2101/001 ,  B23P6/007

摘要： The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.

摘要翻译： 本发明涉及一种用于修复包括具有定向微结构的基材的部件的方法，其中所述修复点包括相应定向的微结构作为周围的基材。 根据本发明的方法，焊料被施加在要修复的点的区域中，并且通过由器件产生的加热效应被焊接到部件上。 在加热效果期间产生温度梯度，即近似温度特性，所述温度特性在要修复的点的区域中从高温到低温。

公开(公告)号：US07967183B2

公开(公告)日：2011-06-28

申请号：US10588024

申请日：2005-01-28

申请人： Dirk Goldschmidt ,  Matthias Oechsner ,  Michael Ott ,  Uwe Paul ,  Ursula Pickert ,  Eckart Schumann ,  Beate Seiler ,  Robert Singer ,  Jan Steinbach ,  Andreas Volek ,  Volker Vosberg

发明人： Dirk Goldschmidt ,  Matthias Oechsner ,  Michael Ott ,  Uwe Paul ,  Ursula Pickert ,  Eckart Schumann ,  Beate Seiler ,  Robert Singer ,  Jan Steinbach ,  Andreas Volek ,  Volker Vosberg

IPC分类号： B23K31/02

CPC分类号： F01D5/005 ,  B23K1/0008 ,  B23K1/0018 ,  B23K1/002 ,  B23K1/005 ,  B23K2101/001 ,  B23P6/007

摘要： The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.

摘要翻译： 本发明涉及一种用于修复包括具有定向微结构的基材的部件的方法，其中所述修复点包括相应定向的微结构作为周围的基材。 根据本发明的方法，焊料被施加在要修复的点的区域中，并且通过由器件产生的加热效应被焊接到部件上。 在加热效果期间产生温度梯度，即近似温度特性，所述温度特性在要修复的点的区域中从高温到低温。