发明授权
- 专利标题: Semiconductor package
- 专利标题(中): 半导体封装
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申请号: US12493290申请日: 2009-06-29
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公开(公告)号: US07968918B2公开(公告)日: 2011-06-28
- 发明人: Sung Min Kim
- 申请人: Sung Min Kim
- 申请人地址: KR Gyeonggi-do
- 专利权人: Hynix Semiconductor Inc.
- 当前专利权人: Hynix Semiconductor Inc.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Ladas & Parry LLP
- 优先权: KR10-2009-0052742 20090615
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L21/70 ; H01L29/40 ; H01L23/04
摘要:
A semiconductor package includes a semiconductor chip having two or more regions that partially overlap so as to define an overlapping region. Through-holes are defined through the two or more partially overlapping regions. One or more first electrodes are disposed on inner surfaces of the semiconductor chip within the through-holes. One or more second electrodes are disposed so as to be insulated from the first electrodes. The one or more second electrodes are at least partially disposed in the overlapping region. Insulation members are disposed in the through-holes.
公开/授权文献
- US20100314742A1 SEMICONDUCTOR PACKAGE 公开/授权日:2010-12-16