Invention Grant
- Patent Title: Cooling
- Patent Title (中): 冷却
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Application No.: US12432199Application Date: 2009-04-29
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Publication No.: US07969727B2Publication Date: 2011-06-28
- Inventor: Robert Tozer , Cullen Bash , Chandrakant Patel
- Applicant: Robert Tozer , Cullen Bash , Chandrakant Patel
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
According to one embodiment, an equipment enclosure includes a plurality of equipment elements, each element having one or more heat generating sources. A heat exchanger is mounted towards the top of the equipment enclosure. The heat exchanger is thermally coupled to at least some of the heat generating sources. The enclosure includes an exhaust vent through which air heated by the heat exchanger may be evacuated, and an inlet vent through which air from outside the equipment enclosure may be drawn into the equipment enclosure to cool the heat exchanger by stack effect ventilation.
Public/Granted literature
- US20100277864A1 COOLING Public/Granted day:2010-11-04
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