发明授权
- 专利标题: Process for producing microsphere with use of metal substrate having through-hole
- 专利标题(中): 使用具有通孔的金属基材制造微球的方法
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申请号: US11577474申请日: 2005-10-11
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公开(公告)号: US07972543B2公开(公告)日: 2011-07-05
- 发明人: Mitsutoshi Nakajima , Taiji Nishi , Seiichi Kanai , Takenori Kitani , Motohiro Fukuda
- 申请人: Mitsutoshi Nakajima , Taiji Nishi , Seiichi Kanai , Takenori Kitani , Motohiro Fukuda
- 申请人地址: JP Tsukuba-shi JP Kurashiki-shi JP Tsukuba-shi
- 专利权人: National Agriculture and Food Research Organization,Kuraray Co., Ltd.,Mitsutoshi Nakajima
- 当前专利权人: National Agriculture and Food Research Organization,Kuraray Co., Ltd.,Mitsutoshi Nakajima
- 当前专利权人地址: JP Tsukuba-shi JP Kurashiki-shi JP Tsukuba-shi
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2004-302378 20041018
- 国际申请: PCT/JP2005/018688 WO 20051011
- 国际公布: WO2006/043443 WO 20060427
- 主分类号: B29B9/00
- IPC分类号: B29B9/00
摘要:
An object of the present invention is to provide a process for producing microspheres that are solid microparticles or liquid microparticles for use as an emulsion employed in the food industry, production of medicine and cosmetic etc. or an emulsion for DDS (drug delivery system). The object is attained by a process for producing a microsphere including: separating a disperse phase from a continuous phase by a substrate 1 having a through-hole 7; and extruding the disperse phase into the continuous phase through the through-hole 7, in which the substrate having the through-hole 7 with a width of 0.5 to 500 μm, a depth of 10 μm to 6000 μm and a ratio of the width to the depth of the through-hole 7 of 1 to 1/30 is a metal substrate.
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