发明授权
- 专利标题: Planarizing coating method
- 专利标题(中): 平面涂布方法
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申请号: US11937266申请日: 2007-11-08
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公开(公告)号: US07972654B2公开(公告)日: 2011-07-05
- 发明人: Akihiko Nakamura
- 申请人: Akihiko Nakamura
- 申请人地址: JP Kanagawa
- 专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址: JP Kanagawa
- 代理机构: Carrier Blackman & Associates, P.C.
- 代理商 Joseph P. Carrier; William D. Blackman
- 优先权: JP2006-302181 20061108
- 主分类号: B05D3/12
- IPC分类号: B05D3/12 ; B05D1/38
摘要:
A planarizing coating method for filling a step between patterns formed on a board surface, includes the steps of: preparing at least two types of coating liquids different in non-volatile matter densities, first coating one of the coating liquids higher in density on the board surface, rotating the board so as to leave the one coating liquid inside the step and such that, at the same time, substantially none of the one coating liquid is left on a pattern crest of the patterns, subsequently coating another of the coating liquids lower in non-volatile matter density on the board surface, and rotating the board so that the coating liquid lower in density is left on a coating film comprising the one coating liquid higher in density and such that, at the same time, substantially none of the other coating liquid lower in density left on the pattern crest.
公开/授权文献
- US20080254215A1 PLANARIZING COATING METHOD 公开/授权日:2008-10-16
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