发明授权
US07977132B2 Extension of contact pads to the die edge via electrical isolation
有权
通过电气隔离将接触垫延伸到管芯边缘
- 专利标题： Extension of contact pads to the die edge via electrical isolation
- 专利标题（中）： 通过电气隔离将接触垫延伸到管芯边缘
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申请号： US12436442申请日： 2009-05-06
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公开(公告)号： US07977132B2公开(公告)日： 2011-07-12
- 发明人: Tal Margalith , Stefano Schiaffino , Henry Kwong-Hin Choy
- 申请人： Tal Margalith , Stefano Schiaffino , Henry Kwong-Hin Choy
- 申请人地址： NL Eindhoven US CA San Jose
- 专利权人： Koninklijke Philips Electronics N.V.,Philps Lumileds Lighting Company, LLC
- 当前专利权人： Koninklijke Philips Electronics N.V.,Philps Lumileds Lighting Company, LLC
- 当前专利权人地址： NL Eindhoven US CA San Jose
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
Light emitting diode (LED) dies are fabricated by forming LED layers including a first conductivity type layer, a light-emitting layer, and a second conductivity type layer. Trenches are formed in the LED layers that reach at least partially into the first conductivity type layer. Electrically insulation regions are formed in or next to at least portions of the first conductivity type layer along the die edges. A first conductivity bond pad layer is formed to electrically contact the first conductivity type layer and extend over the singulation streets between the LED dies. A second conductivity bond pad layer is formed to electrically contact the second conductivity type layer, and extend over the singulation streets between the LED dies and the electrically insulated portions of the first conductivity type layer. The LED dies are mounted to submounts and the LED dies are singulated along the singulation streets between the LED dies.
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