发明授权
- 专利标题: Heat processing apparatus and heat processing method
- 专利标题(中): 热处理设备和热处理方法
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申请号: US11624404申请日: 2007-01-18
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公开(公告)号: US07980003B2公开(公告)日: 2011-07-19
- 发明人: Shigeki Aoki , Yuichi Sakai , Mitsuo Yamashita , Hiroshi Shinya
- 申请人: Shigeki Aoki , Yuichi Sakai , Mitsuo Yamashita , Hiroshi Shinya
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2006-015926 20060125
- 主分类号: F26B3/001
- IPC分类号: F26B3/001
摘要:
A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.
公开/授权文献
- US20070169373A1 HEAT PROCESSING APPARATUS AND HEAT PROCESSING METHOD 公开/授权日:2007-07-26