Invention Grant
- Patent Title: Process for producing a chip using a mold
- Patent Title (中): 使用模具制造芯片的工艺
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Application No.: US12388179Application Date: 2009-02-18
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Publication No.: US07981304B2Publication Date: 2011-07-19
- Inventor: Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
- Applicant: Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2005-258034 20050906; JP2006-194905 20060714
- Main IPC: C03C15/00
- IPC: C03C15/00

Abstract:
A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
Public/Granted literature
- US20090152239A1 PROCESS FOR PRODUCING A CHIP USING A MOLD Public/Granted day:2009-06-18
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