发明授权
US07985662B2 Method for manufacturing dies formed with a dielectric layer 有权
用电介质层形成模具的方法

Method for manufacturing dies formed with a dielectric layer
摘要:
A method of manufacturing dies formed with a dielectric layer is revealed. A liquid dielectric layer is formed on the dicing tape. The liquid dielectric layer is heated to be sticky. Then, a wafer is attached to the dielectric layer on the dicing tape. The wafer is diced into a plurality of dies on the dicing tape. The dies with attached portions of the dielectric layer are picked up to be peeled and separated from the dicing tape. The implementation of the dicing tape can be expanded to resolve various issues such as wafer contaminations, wafer warpage due to multiple heating and mismatching of thermal expansion coefficients, and wafer singulation problems due to alignment difficulties. The wafer handling steps can further be reduced to increase processing yield and to enhance easy and better processing.
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