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公开(公告)号：US20130030270A1
公开(公告)日：2013-01-31
申请号：US13473523
申请日：2012-05-16
申请人： Jin-Chern Chiou , Yu-Chieh Huang
发明人： Jin-Chern Chiou , Yu-Chieh Huang
IPC分类号： A61B6/00 , A61B5/0478
CPC分类号： A61B5/0476 , A61B5/14553 , A61B5/6803 , A61B5/6814
摘要： A physiological signal collection unit is for use with a physiological signal measuring apparatus to measure physiological signals from an anatomical part of a test subject, in which the anatomical part is covered with hair. The physiological signal collection unit includes a detector and a wearable member. The detector includes a circuit substrate defining a substrate-through-hole to permit hair strands to extend through, an electrical connector, and at least one signal collecting component. The wearable member is to be worn on the anatomical part of the test subject, and is formed with a through-hole having a size smaller than size of the circuit substrate. The through-hole permits the hair strands extending through the circuit substrate to extend through the wearable member.
摘要翻译： 生理信号收集单元用于与生理信号测量装置一起使用，以测量来自测试对象的解剖部分的生理信号，其中解剖部分被毛发覆盖。 生理信号收集单元包括检测器和可穿戴构件。 检测器包括限定通孔的电路基板，以允许发丝穿过，电连接器和至少一个信号收集部件。 可穿戴构件将被佩戴在测试对象的解剖部分上，并且形成有尺寸小于电路基板的尺寸的通孔。 通孔允许延伸穿过电路基板的发条延伸穿过可穿戴构件。
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公开(公告)号：US08039279B2
公开(公告)日：2011-10-18
申请号：US11890493
申请日：2007-08-07
IPC分类号： H01L21/00
CPC分类号： H01L33/40 , H01L33/0095 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the invention relates to a method of manufacturing a light emitting diode. The method includes forming an insulating layer on an area, not covered by a seed layer, of at least one of a p-type semiconductor layer and an n-type semiconductor layer, wherein the impurity concentration varies on the surface of the area; and immersing at least part of the seed layer into an electrolyte having metal ions which tend to reduce and deposit on the seed layer under no bias voltage.
摘要翻译： 本发明的一个实施例涉及制造发光二极管的方法。 该方法包括在p型半导体层和n型半导体层中的至少一种的区域上形成不被种子层覆盖的区域的绝缘层，其中杂质浓度在该区域的表面上变化; 并且将至少部分种子层浸入具有金属离子的电解质中，所述金属离子倾向于在无偏压下在种子层上减少和沉积。
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公开(公告)号：US08232567B2
公开(公告)日：2012-07-31
申请号：US12425730
申请日：2009-04-17
申请人： Jing-Jie Dai , Wen-Chung Shih , Bo-Yuan Huang , Su-Hui Lin , Yu-Chieh Huang
发明人： Jing-Jie Dai , Wen-Chung Shih , Bo-Yuan Huang , Su-Hui Lin , Yu-Chieh Huang
IPC分类号： H01L33/00
摘要： A light emitting device, includes a substrate; a first semiconductor layer on the substrate; an active layer on the first semiconductor layer; a second semiconductor layer on the active layer; a transparent conductive layer on the second semiconductor layer; and a plurality of pillar structures with a hollow structure in the portion surface of the first semiconductor layer, thereby, the light extraction efficiency of the light emitting device can be improved due to the pillar structures with a hollow structure.
摘要翻译： 发光装置，包括基板; 在所述基板上的第一半导体层; 在第一半导体层上的有源层; 有源层上的第二半导体层; 在所述第二半导体层上的透明导电层; 以及在第一半导体层的部分表面中具有中空结构的多个柱结构，从而由于具有中空结构的柱结构，可以提高发光器件的光提取效率。
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公开(公告)号：US07985662B2
公开(公告)日：2011-07-26
申请号：US12423486
申请日：2009-04-14
申请人： Yu-Chieh Huang
发明人： Yu-Chieh Huang
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , H01L2224/27013 , H01L2224/83191
摘要： A method of manufacturing dies formed with a dielectric layer is revealed. A liquid dielectric layer is formed on the dicing tape. The liquid dielectric layer is heated to be sticky. Then, a wafer is attached to the dielectric layer on the dicing tape. The wafer is diced into a plurality of dies on the dicing tape. The dies with attached portions of the dielectric layer are picked up to be peeled and separated from the dicing tape. The implementation of the dicing tape can be expanded to resolve various issues such as wafer contaminations, wafer warpage due to multiple heating and mismatching of thermal expansion coefficients, and wafer singulation problems due to alignment difficulties. The wafer handling steps can further be reduced to increase processing yield and to enhance easy and better processing.
摘要翻译： 揭示了由电介质层形成的模具的制造方法。 在切割带上形成液体介质层。 将液体介电层加热粘稠。 然后，在切割带上的电介质层上附着晶片。 将晶片切割成切割带上的多个管芯。 拾取具有电介质层的附接部分的模具以从切割带剥离并分离。 可以扩展切割胶带的实现，以解决诸如晶片污染，由于多次加热造成的晶片翘曲和热膨胀系数不匹配的各种问题，以及由于对准困难而导致的晶片切割问题。 可以进一步减小晶片处理步骤以提高加工成品率，并且增强容易和更好的加工。
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5.发明申请Light emitting device having pillar structure with hollow structure and the forming method thereof 有权具有中空结构的柱状结构的发光装置及其形成方法公开(公告)号：US20100244053A1
公开(公告)日：2010-09-30
申请号：US12425730
申请日：2009-04-17
申请人： Jing-Jie DAI , Wen-Chung Shih , Bo-Yuan Huang , Su-Hui Lin , Yu-Chieh Huang
发明人： Jing-Jie DAI , Wen-Chung Shih , Bo-Yuan Huang , Su-Hui Lin , Yu-Chieh Huang
IPC分类号： H01L33/00
摘要： A light emitting device, includes a substrate; a first semiconductor layer on the substrate; an active layer on the first semiconductor layer; a second semiconductor layer on the active layer; a transparent conductive layer on the second semiconductor layer; and a plurality of pillar structures with a hollow structure in the portion surface of the first semiconductor layer, thereby, the light extraction efficiency of the light emitting device can be improved due to the pillar structures with a hollow structure.
摘要翻译： 发光装置，包括基板; 在所述基板上的第一半导体层; 在第一半导体层上的有源层; 有源层上的第二半导体层; 在所述第二半导体层上的透明导电层; 以及在第一半导体层的部分表面中具有中空结构的多个柱结构，从而由于具有中空结构的柱结构，可以提高发光器件的光提取效率。
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公开(公告)号：US20080032434A1
公开(公告)日：2008-02-07
申请号：US11890493
申请日：2007-08-07
IPC分类号： H01L21/00
CPC分类号： H01L33/40 , H01L33/0095 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the invention relates to a method of manufacturing a light emitting diode. The method includes forming an insulating layer on an area, not covered by a seed layer, of at least one of a p-type semiconductor layer and an n-type semiconductor layer, wherein the impurity concentration varies on the surface of the area; and immersing at least part of the seed layer into an electrolyte having metal ions which tend to reduce and deposit on the seed layer under no bias voltage.
摘要翻译： 本发明的一个实施例涉及一种制造发光二极管的方法。 该方法包括在p型半导体层和n型半导体层中的至少一种的区域上形成不被种子层覆盖的区域的绝缘层，其中杂质浓度在该区域的表面上变化; 并且将至少部分种子层浸入具有金属离子的电解质中，所述金属离子倾向于在无偏压下在种子层上减少和沉积。
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公开(公告)号：US09420961B2
公开(公告)日：2016-08-23
申请号：US13473523
申请日：2012-05-16
申请人： Jin-Chern Chiou , Yu-Chieh Huang
发明人： Jin-Chern Chiou , Yu-Chieh Huang
IPC分类号： A61B5/1455 , A61B5/0476 , A61B5/00
CPC分类号： A61B5/0476 , A61B5/14553 , A61B5/6803 , A61B5/6814
摘要： A physiological signal collection unit is for use with a physiological signal measuring apparatus to measure physiological signals from an anatomical part of a test subject, in which the anatomical part is covered with hair. The physiological signal collection unit includes a detector and a wearable member. The detector includes a circuit substrate defining a substrate-through-hole to permit hair strands to extend through, an electrical connector, and at least one signal collecting component. The wearable member is to be worn on the anatomical part of the test subject, and is formed with a through-hole having a size smaller than size of the circuit substrate. The through-hole permits the hair strands extending through the circuit substrate to extend through the wearable member.
摘要翻译： 生理信号收集单元用于与生理信号测量装置一起使用，以测量来自测试对象的解剖部分的生理信号，其中解剖部分被毛发覆盖。 生理信号收集单元包括检测器和可穿戴构件。 检测器包括限定通孔的电路基板，以允许发丝穿过，电连接器和至少一个信号收集部件。 可穿戴构件将被佩戴在测试对象的解剖部分上，并且形成有尺寸小于电路基板的尺寸的通孔。 通孔允许延伸穿过电路基板的发条延伸穿过可穿戴构件。
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公开(公告)号：US08407837B1
公开(公告)日：2013-04-02
申请号：US13633170
申请日：2012-10-02
申请人： Yu-Chieh Huang , Chung-Yung Huang , Chung-Yi Huang
发明人： Yu-Chieh Huang , Chung-Yung Huang , Chung-Yi Huang
IPC分类号： A61G7/002
CPC分类号： A61G7/002 , A61G7/015 , A61G7/05 , A61G7/0506 , A61G2203/76
摘要： A foldable structure for a hospital bed contains two mounts, a bed frame, and a bed plane, each mount including two rotary positioning pieces, wherein each rotary positioning piece has a hole and an arcuate groove to axially connect the each rotary positioning piece with two coupling elements of the bed frame, such that the bed frame rotates relative to the two mounts, the each rotary positioning piece has two orifices corresponding to two ends of the arcuate groove so that a spring pin of each side of the bed frame is inserted into one of the two orifices of the each rotary positioning pieces, hence the spring pin is pushed out of the one of the two orifices of the each rotary positioning pieces, a coupling element in the arcuate groove rotates smoothly relative to a coupling element in the hole, thus retracting or expanding the bed frame easily.
摘要翻译： 用于医院床的可折叠结构包括两个安装件，床架和床平面，每个安装件包括两个旋转定位件，其中每个旋转定位件具有孔和弧形槽，以将每个旋转定位件与两个 床架的联接元件使得床架相对于两个安装座旋转，每个旋转定位件具有对应于弓形槽的两端的两个孔，使得床架的每一侧的弹簧销插入 每个旋转定位件的两个孔中的一个，因此弹簧销被推出每个旋转定位件的两个孔中的一个孔中，弓形槽中的联接元件相对于孔中的联接元件平滑地旋转 ，因此容易地缩回或扩大床架。
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公开(公告)号：US20100261337A1
公开(公告)日：2010-10-14
申请号：US12423486
申请日：2009-04-14
申请人： Yu-Chieh HUANG
发明人： Yu-Chieh HUANG
IPC分类号： H01L21/304
CPC分类号： H01L21/78 , H01L2224/27013 , H01L2224/83191
摘要： A method of manufacturing dies formed with a dielectric layer is revealed. A liquid dielectric layer is formed on the dicing tape. The liquid dielectric layer is heated to be sticky. Then, a wafer is attached to the dielectric layer on the dicing tape. The wafer is diced into a plurality of dies on the dicing tape. The dies with attached portions of the dielectric layer are picked up to be peeled and separated from the dicing tape. The implementation of the dicing tape can be expanded to resolve various issues such as wafer contaminations, wafer warpage due to multiple heating and mismatching of thermal expansion coefficients, and wafer singulating problems due to alignment difficulties. The wafer handling steps can further be reduced to increase processing yield and to enhance easy and better processing.
摘要翻译： 揭示了由电介质层形成的模具的制造方法。 在切割带上形成液体介质层。 将液体介电层加热粘稠。 然后，在切割带上的电介质层上附着晶片。 将晶片切割成切割带上的多个管芯。 拾取具有电介质层的附接部分的模具以从切割带剥离并分离。 可以扩展切割胶带的实现，以解决诸如晶片污染，由于多次加热引起的晶片翘曲和热膨胀系数失配的各种问题，以及由于对准困难而导致的晶片分离问题。 可以进一步减小晶片处理步骤以提高加工成品率，并且增强容易和更好的加工。
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