Invention Grant
- Patent Title: Assembly device
- Patent Title (中): 装配装置
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Application No.: US12334633Application Date: 2008-12-15
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Publication No.: US07987965B2Publication Date: 2011-08-02
- Inventor: Chia-En Lee
- Applicant: Chia-En Lee
- Applicant Address: HK Kowloon
- Assignee: FIH (Hong Kong) Limited
- Current Assignee: FIH (Hong Kong) Limited
- Current Assignee Address: HK Kowloon
- Agent Steven M. Reiss
- Priority: CN200710203341 20071221
- Main IPC: B65G15/44
- IPC: B65G15/44
Abstract:
An assembly device (20) used in assembling portable electronic devices is provided. The assembly device (20) includes a support, a transmission belt (24) moveably mounted on the support and several fans (25) rotatably mounted on the transmission belt (24) for dissipating heat in the area of the transmission belt (24).
Public/Granted literature
- US20090159398A1 ASSEMBLY DEVICE Public/Granted day:2009-06-25
Information query
IPC分类:
