公开(公告)号：US08445327B2

公开(公告)日：2013-05-21

申请号：US13403714

申请日：2012-02-23

Applicant: Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L21/00

CPC classification number: H01L33/0079 ,  H01L24/26 ,  H01L24/93 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug.

Abstract translation: 提供了发光二极管的晶片级封装工艺。 首先，在生长基板上形成半导体堆叠层。 然后在半导体堆叠层上形成多个阻挡图案和多个反射层，其中每个反射层被一个屏障图案包围。 然后在半导体堆叠层上形成第一结合层以覆盖阻挡图案和反射层。 此后，设置具有多个第二接合层和彼此电绝缘的多个导电插塞的承载基板，并且第一接合层与第二接合层接合。 然后将半导体堆叠层与生长衬底分离。 接下来，对半导体堆叠层进行图案化以形成多个半导体堆叠图案。 接下来，每个半导体堆叠图案电连接到导电插头。

公开(公告)号：US08362511B2

公开(公告)日：2013-01-29

申请号：US13225171

申请日：2011-09-02

Applicant: Kuo-Lung Fang ,  Chia-En Lee ,  Chao-Chen Ye

Inventor： Kuo-Lung Fang ,  Chia-En Lee ,  Chao-Chen Ye

IPC: H01L29/18

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/46 ,  H01L33/647

Abstract: A semiconductor light emitting structure including a substrate, a second type electrode layer, a reflecting layer, an insulating layer, a first type electrode layer, a first type semiconductor layer, an active layer and a second type semiconductor layer is provided. The second type electrode layer formed on the substrate has a current spreading grating formed by several conductive pillars and conductive walls, which are staggered and connected to each other. The reflecting layer and the insulating layer are formed on the second type electrode layer in sequence, and cover each conductive pillar and each conductive wall. The first type electrode layer, the first type semiconductor layer and the active layer are formed on the insulating layer in sequence. The second type semiconductor layer is formed on the active layer, and covers each conductive pillar and each conductive wall.

Abstract translation: 提供了包括基板，第二类型电极层，反射层，绝缘层，第一类型电极层，第一类型半导体层，有源层和第二类型半导体层的半导体发光结构。 形成在基板上的第二类型电极层具有通过交错并彼此连接的多个导电柱和导电壁形成的电流扩散光栅。 反射层和绝缘层依次形成在第二类型电极层上，并且覆盖每个导电柱和每个导电壁。 第一类型电极层，第一类型半导体层和有源层依次形成在绝缘层上。 第二类型半导体层形成在有源层上，并覆盖每个导电柱和每个导电壁。

公开(公告)号：US20120286307A1

公开(公告)日：2012-11-15

申请号：US13225171

申请日：2011-09-02

Applicant: Kuo-Lung Fang ,  Chia-En Lee ,  Chao-Chen Ye

Inventor： Kuo-Lung Fang ,  Chia-En Lee ,  Chao-Chen Ye

IPC: H01L33/60

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/46 ,  H01L33/647

Abstract: A semiconductor light emitting structure including a substrate, a second type electrode layer, a reflecting layer, an insulating layer, a first type electrode layer, a first type semiconductor layer, an active layer and a second type semiconductor layer is provided. The second type electrode layer formed on the substrate has a current spreading grating formed by several conductive pillars and conductive walls, which are staggered and connected to each other. The reflecting layer and the insulating layer are formed on the second type electrode layer in sequence, and cover each conductive pillar and each conductive wall. The first type electrode layer, the first type semiconductor layer and the active layer are formed on the insulating layer in sequence. The second type semiconductor layer is formed on the active layer, and covers each conductive pillar and each conductive wall.

Abstract translation: 提供了包括基板，第二类型电极层，反射层，绝缘层，第一类型电极层，第一类型半导体层，有源层和第二类型半导体层的半导体发光结构。 形成在基板上的第二类型电极层具有通过交错并彼此连接的多个导电柱和导电壁形成的电流扩散光栅。 反射层和绝缘层依次形成在第二类型电极层上，并且覆盖每个导电柱和每个导电壁。 第一类型电极层，第一类型半导体层和有源层依次形成在绝缘层上。 第二类型半导体层形成在有源层上，并覆盖每个导电柱和每个导电壁。

公开(公告)号：US07867020B2

公开(公告)日：2011-01-11

申请号：US12604914

申请日：2009-10-23

Applicant: Chia-En Lee

Inventor： Chia-En Lee

IPC: H01R3/00

CPC classification number: G06F1/1632 ,  H04M1/24

Abstract: A fixture includes a base seat, a resist mechanism, a drive mechanism and an adjust mechanism. The resist mechanism is fixed to the base seat and includes a connector. The drive mechanism is fixed to the base seat. The adjust mechanism is fixed to the base seat and includes a connecting board. The connecting board has a power module attached thereto. The adjust mechanism can adjust the power module relative to the connector. The drive mechanism can drive the connector to move towards the power module.

Abstract translation: 固定装置包括基座，抵抗机构，驱动机构和调节机构。 抗蚀剂机构固定在基座上并包括连接器。 驱动机构固定在基座上。 调节机构固定在基座上并具有连接板。 连接板具有附接到其上的功率模块。 调节机构可以相对于连接器调整功率模块。 驱动机构可以驱动连接器朝向电源模块移动。

公开(公告)号：US20100258827A1

公开(公告)日：2010-10-14

申请号：US12469669

申请日：2009-05-20

Applicant: Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L33/00 ,  H01L21/60

CPC classification number: H01L33/0079 ,  H01L24/26 ,  H01L24/93 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug.

Abstract translation: 提供了发光二极管的晶片级封装工艺。 首先，在生长基板上形成半导体堆叠层。 然后在半导体堆叠层上形成多个阻挡图案和多个反射层，其中每个反射层被一个屏障图案包围。 然后在半导体堆叠层上形成第一结合层以覆盖阻挡图案和反射层。 此后，设置具有多个第二接合层和彼此电绝缘的多个导电插塞的承载基板，并且第一接合层与第二接合层接合。 然后将半导体堆叠层与生长衬底分离。 接下来，对半导体堆叠层进行图案化以形成多个半导体堆叠图案。 接下来，每个半导体堆叠图案电连接到导电插头。

公开(公告)号：US20100038208A1

公开(公告)日：2010-02-18

申请号：US12341935

申请日：2008-12-22

Applicant: CHIA-EN LEE ,  YONG YANG

Inventor： CHIA-EN LEE ,  YONG YANG

IPC: B65G47/38

CPC classification number: B65G47/763 ,  B65G47/519

Abstract: A conveyor device is described. The conveyor device includes a conveyor belt and a receiver including a storing compartment and a guiding board. The guiding board is spaced above the conveyor belt, used to guide a part moving on the conveyor belt into the storing compartment without having to stop the conveyor device.

Abstract translation: 描述了传送装置。 输送装置包括输送带和包括储存室和引导板的接收器。 引导板在输送带上方间隔开，用于将输送带上移动的部分引导到储存室中，而不必停止输送装置。

公开(公告)号：US07596897B2

公开(公告)日：2009-10-06

申请号：US12141206

申请日：2008-06-18

Applicant: Chia-En Lee

Inventor： Chia-En Lee

IPC: G09F11/18

CPC classification number: G09F11/30 ,  G09F11/08 ,  G09F17/00

Abstract: A banner displaying device (100) includes a receiving member (10), a rotating member (30) and a plurality of banners (50). The receiving member defines a cavity (115) and an opening (117) communicating with the cavity therein. The rotating member is rotatably mounted on the receiving member, and includes an axle (31) and a plurality of partitions (32) mounted on the axle and received in the cavity. The banners and the partitions are alternately mounted on the axle.

Abstract translation: 横幅显示装置（100）包括接收构件（10），旋转构件（30）和多个横幅（50）。 接收构件限定了空腔（115）和与其中的空腔连通的开口（117）。 旋转构件可旋转地安装在接收构件上，并且包括轴（31）和安装在轴上并容纳在空腔中的多个隔板（32）。 横幅和隔板交替安装在轴上。

公开(公告)号：US20090159398A1

公开(公告)日：2009-06-25

申请号：US12334633

申请日：2008-12-15

Applicant: CHIA-EN LEE

Inventor： CHIA-EN LEE

IPC: B23Q3/00

CPC classification number: B65G15/00 ,  Y10S198/952

Abstract: An assembly device (20) used in assembling portable electronic devices is provided. The assembly device (20) includes a support, a transmission belt (24) moveably mounted on the support and several fans (25) rotatably mounted on the transmission belt (24) for dissipating heat in the area of the transmission belt (24).

Abstract translation: 提供了用于组装便携式电子设备的组装装置（20）。 组装装置（20）包括支撑件，可移动地安装在支撑件上的传动带（24）和可旋转地安装在传动带（24）上的几个风扇（25），用于在传动带（24）的区域中散热。

公开(公告)号：USD680975S1

公开(公告)日：2013-04-30

申请号：US29406557

申请日：2011-11-16

Applicant: Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

Designer： Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

公开(公告)号：US07987965B2

公开(公告)日：2011-08-02

申请号：US12334633

申请日：2008-12-15

Applicant: Chia-En Lee

Inventor： Chia-En Lee

IPC: B65G15/44

CPC classification number: B65G15/00 ,  Y10S198/952

Abstract: An assembly device (20) used in assembling portable electronic devices is provided. The assembly device (20) includes a support, a transmission belt (24) moveably mounted on the support and several fans (25) rotatably mounted on the transmission belt (24) for dissipating heat in the area of the transmission belt (24).

Abstract translation: 提供了用于组装便携式电子设备的组装装置（20）。 组装装置（20）包括支撑件，可移动地安装在支撑件上的传动带（24）和可旋转地安装在传动带（24）上的几个风扇（25），用于在传动带（24）的区域中散热。