公开(公告)号：US08415683B2

公开(公告)日：2013-04-09

申请号：US12464859

申请日：2009-05-12

Applicant: Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L27/15

CPC classification number: H01L33/0095 ,  H01L21/78 ,  H01L33/20 ,  H01L33/44

Abstract: The present invention provides a manufacturing method of an LED chip. First, a device layer is formed on a growth substrate, wherein the device layer has a first surface connected to the growth substrate and a second surface. Next, a plurality of first trenches are formed on the second surface of the device layer. Then, a protection layer is formed on the side walls of the first trenches. After that, the second surface is bonded with a supporting substrate and the device layer is then separated from the growth substrate. Further, a plurality of second trenches corresponding to the first trenches are formed in the device layer to form a plurality of LEDs, wherein the second trenches extend from the first surface to the bottom portions of the first trenches. Furthermore, a plurality of electrodes are formed on the first surface of the device layer.

Abstract translation: 本发明提供一种LED芯片的制造方法。 首先，在生长衬底上形成器件层，其中器件层具有连接到生长衬底的第一表面和第二表面。 接下来，在器件层的第二表面上形成多个第一沟槽。 然后，在第一沟槽的侧壁上形成保护层。 之后，将第二表面与支撑基板接合，然后将器件层与生长衬底分离。 此外，在器件层中形成对应于第一沟槽的多个第二沟槽以形成多个LED，其中第二沟槽从第一沟槽的第一表面延伸到底部。 此外，在器件层的第一表面上形成多个电极。

公开(公告)号：USD668234S1

公开(公告)日：2012-10-02

申请号：US29406549

申请日：2011-11-16

Applicant: Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

Designer： Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

公开(公告)号：US08225670B2

公开(公告)日：2012-07-24

申请号：US12550886

申请日：2009-08-31

Applicant: Chia-En Lee

Inventor： Chia-En Lee

IPC: G01H11/00

CPC classification number: G01H11/00

Abstract: A device of testing a vibrating device includes a housing, a connector, an indicator, and a vibrating sensing apparatus. The connector, the indicator, and the vibrating sensing apparatus are mounted with the housing, and electronically connected in series. When the test device is vibrated by a portable electronic device received in the housing, the vibrating sensing apparatus forms a closed circuit with the connector and the indicator to activate the indicator to indicate whether the vibrating performance of the portable electronic device is normal or not.

Abstract translation: 测试振动装置的装置包括壳体，连接器，指示器和振动感测装置。 连接器，指示器和振动感测装置安装在外壳上，并串联电子连接。 当测试装置被接收在壳体中的便携式电子设备振动时，振动感测装置与连接器和指示器形成闭合电路，以激活指示器以指示便携式电子设备的振动性能是否正常。

公开(公告)号：US07762389B2

公开(公告)日：2010-07-27

申请号：US12141225

申请日：2008-06-18

Applicant: Chia-En Lee ,  Yong Yang

Inventor： Chia-En Lee ,  Yong Yang

IPC: B65G23/44

CPC classification number: B65G15/60

Abstract: A conveying mechanism (20) includes a main rotating member (22), a subsidiary rotating member (23) and a transport belt (24). The subsidiary rotating member includes a first driven axle (231) and a second driven axle (232) both driven by the main rotating member, a diameter of the first driven axle is less than that of the second driven axle and the main rotating member. The transport belt is wrapped around the main rotating member and the subsidiary rotating member, and driven to move by the main rotating member.

Abstract translation: 输送机构（20）包括主旋转构件（22），副旋转构件（23）和输送带（24）。 辅助旋转构件包括由主旋转构件驱动的第一从动轴（231）和第二从动轴（232），第一从动轴的直径小于第二从动轴和主旋转构件的直径。 传送带缠绕在主旋转构件和副旋转构件周围，并被主旋转构件驱动移动。

公开(公告)号：USD669869S1

公开(公告)日：2012-10-30

申请号：US29406563

申请日：2011-11-16

Applicant: Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

Designer： Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

公开(公告)号：US08020284B2

公开(公告)日：2011-09-20

申请号：US12512376

申请日：2009-07-30

Applicant: Chia-En Lee

Inventor： Chia-En Lee

IPC: B23P21/00

CPC classification number: H04M1/24 ,  G01R31/01 ,  Y10T29/5191 ,  Y10T29/5313 ,  Y10T29/53365 ,  Y10T29/53374 ,  Y10T29/53404

Abstract: A production line used to assemble and test some electronic elements includes a first assembly line used to assemble some electronic elements requiring a relatively high requirements of cleanliness factor, a second assembly line used to assemble some electronic elements requiring a relatively low requirements of cleanliness factor, a first testing line used to do some testing items with a relatively high requirements of lightness, a second testing line used to do some testing items with a relatively low requirements of lightness, and a third testing line do some testing items requiring a relatively high requirements of cleanliness factor, the first assembly line, the second assembly line, the first testing line, the second testing line, and the third testing line are located adjacent to each other and connected together in series.

Abstract translation: 用于组装和测试一些电子元件的生产线包括用于组装需要相对较高清洁度要求的一些电子元件的第一组装线，用于组装需要相对较低清洁度要求的一些电子元件的第二组装线， 第一条测试线用于做一些相对较高亮度要求的测试项目，第二条测试线用于做一些相对较低亮度要求的测试项目，第三条测试线做一些需要较高要求的测试项目 的清洁因子，第一组装线，第二组装线，第一测试线，第二测试线和第三测试线彼此相邻并串联连接。

公开(公告)号：US20100258818A1

公开(公告)日：2010-10-14

申请号：US12464859

申请日：2009-05-12

Applicant: Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L33/00 ,  H01L21/78

CPC classification number: H01L33/0095 ,  H01L21/78 ,  H01L33/20 ,  H01L33/44

Abstract: The present invention provides a manufacturing method of an LED chip. First, a device layer is formed on a growth substrate, wherein the device layer has a first surface connected to the growth substrate and a second surface. Next, a plurality of first trenches are formed on the second surface of the device layer. Then, a protection layer is formed on the side walls of the first trenches. After that, the second surface is bonded with a supporting substrate and the device layer is then separated from the growth substrate. Further, a plurality of second trenches corresponding to the first trenches are formed in the device layer to form a plurality of LEDs, wherein the second trenches extend from the first surface to the bottom portions of the first trenches. Furthermore, a plurality of electrodes are formed on the first surface of the device layer.

Abstract translation: 本发明提供一种LED芯片的制造方法。 首先，在生长衬底上形成器件层，其中器件层具有连接到生长衬底的第一表面和第二表面。 接下来，在器件层的第二表面上形成多个第一沟槽。 然后，在第一沟槽的侧壁上形成保护层。 之后，将第二表面与支撑基板接合，然后将器件层与生长衬底分离。 此外，在器件层中形成对应于第一沟槽的多个第二沟槽以形成多个LED，其中第二沟槽从第一沟槽的第一表面延伸到底部。 此外，在器件层的第一表面上形成多个电极。

公开(公告)号：US20100032915A1

公开(公告)日：2010-02-11

申请号：US12534769

申请日：2009-08-03

Applicant: Mau-Pin Hsu ,  Chia-Ming Wu ,  Chia-En Lee ,  Ta-Chan Peng

Inventor： Mau-Pin Hsu ,  Chia-Ming Wu ,  Chia-En Lee ,  Ta-Chan Peng

IPC: B60G17/00

CPC classification number: B60G21/073 ,  B60G2200/132 ,  B60G2200/42 ,  B60G2200/446 ,  B60G2204/143 ,  B60G2204/148 ,  B60G2204/4222 ,  B60G2204/4605 ,  B60G2204/82 ,  B60G2204/8304 ,  B60G2206/60 ,  B60G2300/122 ,  B62H1/12 ,  B62K5/01 ,  B62K5/10 ,  B62K13/04 ,  B62K2202/00

Abstract: A motor vehicle is provided. The motor vehicle comprises a vehicle body, a front wheel, a rear wheel and a tilting mechanism. The front wheel, the rear wheel and the tilting mechanism are disposed on the vehicle body. The tilting mechanism comprises a first compensation unit, a first arm, a first wheel, a second compensation unit, a second arm, a second wheel, at least one pipe and a fluid. The first arm is connected to the first compensation unit, and the first wheel. The second arm is connected to the second compensation unit, and the second wheel. The pipe connects the first compensation unit to the second compensation unit. The fluid flows in the first compensation unit, the second compensation unit and the pipe, wherein when the motor vehicle tilts, an extension length of the first compensation unit equals to a compression length of the second compensation unit.

Abstract translation: 提供汽车。 机动车辆包括车身，前轮，后轮和倾斜机构。 前轮，后轮和倾斜机构设置在车体上。 倾斜机构包括第一补偿单元，第一臂，第一轮，第二补偿单元，第二臂，第二轮，至少一个管和流体。 第一臂连接到第一补偿单元和第一轮。 第二臂连接到第二补偿单元和第二轮。 管道将第一补偿单元连接到第二补偿单元。 流体在第一补偿单元，第二补偿单元和管道中流动，其中当机动车辆倾斜时，第一补偿单元的延伸长度等于第二补偿单元的压缩长度。

公开(公告)号：US08445327B2

公开(公告)日：2013-05-21

申请号：US13403714

申请日：2012-02-23

Applicant: Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L21/00

CPC classification number: H01L33/0079 ,  H01L24/26 ,  H01L24/93 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug.

Abstract translation: 提供了发光二极管的晶片级封装工艺。 首先，在生长基板上形成半导体堆叠层。 然后在半导体堆叠层上形成多个阻挡图案和多个反射层，其中每个反射层被一个屏障图案包围。 然后在半导体堆叠层上形成第一结合层以覆盖阻挡图案和反射层。 此后，设置具有多个第二接合层和彼此电绝缘的多个导电插塞的承载基板，并且第一接合层与第二接合层接合。 然后将半导体堆叠层与生长衬底分离。 接下来，对半导体堆叠层进行图案化以形成多个半导体堆叠图案。 接下来，每个半导体堆叠图案电连接到导电插头。

公开(公告)号：US08362511B2

公开(公告)日：2013-01-29

申请号：US13225171

申请日：2011-09-02

Applicant: Kuo-Lung Fang ,  Chia-En Lee ,  Chao-Chen Ye

Inventor： Kuo-Lung Fang ,  Chia-En Lee ,  Chao-Chen Ye

IPC: H01L29/18

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/46 ,  H01L33/647

Abstract: A semiconductor light emitting structure including a substrate, a second type electrode layer, a reflecting layer, an insulating layer, a first type electrode layer, a first type semiconductor layer, an active layer and a second type semiconductor layer is provided. The second type electrode layer formed on the substrate has a current spreading grating formed by several conductive pillars and conductive walls, which are staggered and connected to each other. The reflecting layer and the insulating layer are formed on the second type electrode layer in sequence, and cover each conductive pillar and each conductive wall. The first type electrode layer, the first type semiconductor layer and the active layer are formed on the insulating layer in sequence. The second type semiconductor layer is formed on the active layer, and covers each conductive pillar and each conductive wall.

Abstract translation: 提供了包括基板，第二类型电极层，反射层，绝缘层，第一类型电极层，第一类型半导体层，有源层和第二类型半导体层的半导体发光结构。 形成在基板上的第二类型电极层具有通过交错并彼此连接的多个导电柱和导电壁形成的电流扩散光栅。 反射层和绝缘层依次形成在第二类型电极层上，并且覆盖每个导电柱和每个导电壁。 第一类型电极层，第一类型半导体层和有源层依次形成在绝缘层上。 第二类型半导体层形成在有源层上，并覆盖每个导电柱和每个导电壁。