Invention Grant
- Patent Title: Photoresist composition and method of forming a photoresist pattern using the same
- Patent Title (中): 光致抗蚀剂组合物及其形成方法
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Application No.: US12059113Application Date: 2008-03-31
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Publication No.: US07989136B2Publication Date: 2011-08-02
- Inventor: Jeong-Min Park , Doo-Hee Jung , Hi-Kuk Lee , Hyoc-Min Yoon , Ki-Hyuk Koo
- Applicant: Jeong-Min Park , Doo-Hee Jung , Hi-Kuk Lee , Hyoc-Min Yoon , Ki-Hyuk Koo
- Applicant Address: KR KR
- Assignee: Samsung Electronics Co., Ltd.,Dongjin Semichem Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.,Dongjin Semichem Co., Ltd.
- Current Assignee Address: KR KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2007-0032371 20070402
- Main IPC: G03F7/028
- IPC: G03F7/028 ; G03F7/038
Abstract:
A photoresist composition comprises about 0.5 to about 20 parts by weight of a photo-acid generator, about 10 to about 70 parts by weight of a novolac resin containing a hydroxyl group, about 1 to about 40 parts by weight of a cross-linker that comprises an alkoxymethylmelamine compound, and about 10 to about 150 parts by weight of a solvent.
Public/Granted literature
- US20090042127A1 PHOTORESIST COMPOSITION AND METHOD OF FORMING A PHOTORESIST PATTERN USING THE SAME Public/Granted day:2009-02-12
Information query
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