Invention Grant
- Patent Title: Phase change memory device and method for fabricating the same
- Patent Title (中): 相变存储器件及其制造方法
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Application No.: US11857396Application Date: 2007-09-18
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Publication No.: US07989795B2Publication Date: 2011-08-02
- Inventor: Wei-Su Chen , Yi-Chan Chen , Hong-Hui Hsu , Chien-Min Lee , Der-Sheng Chao , Chih Wei Chen , Ming-Jinn Tsai
- Applicant: Wei-Su Chen , Yi-Chan Chen , Hong-Hui Hsu , Chien-Min Lee , Der-Sheng Chao , Chih Wei Chen , Ming-Jinn Tsai
- Applicant Address: TW Hsinchu TW Taoyuan TW Taichung County
- Assignee: ProMOS Technologies Inc.,Nanya Technology Corporation,Winbond Electronics Corp.
- Current Assignee: ProMOS Technologies Inc.,Nanya Technology Corporation,Winbond Electronics Corp.
- Current Assignee Address: TW Hsinchu TW Taoyuan TW Taichung County
- Priority: TW96101167A 20070110
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
A phase change memory device is provided. The phase change memory device comprises a substrate. An electrode layer is on the substrate. A phase change memory structure is on the electrode layer and electrically connected to the electrode layer, wherein the phase change memory structure comprises a cup-shaped heating electrode on the electrode layer. An insulating layer is on the cup-shaped heating electrode along a first direction covering a portion of the cup-shaped heating electrode. An electrode structure is on the cup-shaped heating electrode along a second direction covering a portion of the insulating layer and the cup-shaped heating electrode. A pair of double spacers is on a pair of sidewalls of the electrode structure covering a portion of the cup-shaped heating electrode, wherein the double spacer comprises a phase change material spacer and an insulating material spacer on a sidewall of the phase change material spacer.
Public/Granted literature
- US20080164504A1 PHASE CHANGE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2008-07-10
Information query
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