发明授权
- 专利标题： White-light light emitting diode chips and fabrication methods thereof
- 专利标题（中）： 白光发光二极管芯片及其制造方法
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申请号： US12417412申请日： 2009-04-02
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公开(公告)号： US07994531B2公开(公告)日： 2011-08-09
- 发明人: Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
- 申请人： Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
- 申请人地址： TW Hsinchu
- 专利权人： VisEra Technologies Company Limited
- 当前专利权人： VisEra Technologies Company Limited
- 当前专利权人地址： TW Hsinchu
- 代理机构： Muncy, Geissler, Olds & Lowe, PLLC
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.