公开(公告)号：US20100252845A1

公开(公告)日：2010-10-07

申请号：US12417412

申请日：2009-04-02

申请人： Chun-Chi Lin ,  Tzu-Han Lin ,  Wei-Hung Kang

发明人： Chun-Chi Lin ,  Tzu-Han Lin ,  Wei-Hung Kang

IPC分类号： H01L33/00 ,  H01L21/78

CPC分类号： H01L33/508

摘要： A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.

摘要翻译： 提供了一种白光LED芯片及其制造方法。 白光LED芯片包括蓝光LED芯片和直接设置在蓝光LED芯片的顶表面上的荧光体层。 该方法包括提供附着在基板上的多个蓝光LED芯片，其中至少一个接触焊盘形成在每个蓝光LED芯片的顶表面上。 在接触垫上形成保护层。 通过成型工艺在蓝光LED芯片的顶表面上形成荧光体层，露出接触垫。 最后，从蓝光LED芯片去除保护层和基板，以形成白光LED芯片。

公开(公告)号：US07994531B2

公开(公告)日：2011-08-09

申请号：US12417412

申请日：2009-04-02

申请人： Chun-Chi Lin ,  Tzu-Han Lin ,  Wei-Hung Kang

发明人： Chun-Chi Lin ,  Tzu-Han Lin ,  Wei-Hung Kang

IPC分类号： H01L33/00

CPC分类号： H01L33/508

摘要： A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.

摘要翻译： 提供了一种白光LED芯片及其制造方法。 白光LED芯片包括蓝光LED芯片和直接设置在蓝光LED芯片的顶表面上的荧光体层。 该方法包括提供附着在基板上的多个蓝光LED芯片，其中至少一个接触焊盘形成在每个蓝光LED芯片的顶表面上。 在接触垫上形成保护层。 通过成型工艺在蓝光LED芯片的顶表面上形成荧光体层，露出接触垫。 最后，从蓝光LED芯片去除保护层和基板，以形成白光LED芯片。

公开(公告)号：US07928655B2

公开(公告)日：2011-04-19

申请号：US12267872

申请日：2008-11-10

申请人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Jui-Ping Weng ,  Wei-Hung Kang

发明人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Jui-Ping Weng ,  Wei-Hung Kang

IPC分类号： H05B33/04

CPC分类号： H01L33/507 ,  H01L24/24 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/0041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a planar top surface, a light-emitting diode (LED) chip disposed over the top surface of the semiconductor substrate, at least two isolated outer wiring layers formed through the semiconductor substrate and electrically connected to the light-emitting diode chip, serving as input terminals, a transparent encapsulating layer with a substantially planar top surface formed over the semiconductor substrate, capping the LED chip and the at least two isolated outer wiring layers, and a lens module adhered to the substantially planar top surface of the transparent encapsulating layer to cap the light-emitting diode chip. In one embodiment, the lens module includes a fluorescent layer and a lens covering or covered by the fluorescent layer.

摘要翻译： 公开了一种发光二极管（LED）装置。 LED装置包括：具有平面顶面的半导体基板，设置在半导体基板的上表面上的发光二极管（LED）芯片，至少两个隔离的外部布线层，形成在半导体基板上并电连接到该光 用作输入端子的透明封装层，形成在所述半导体衬底上方的基本上平坦的顶表面，对所述LED芯片和所述至少两个隔离的外部布线层进行封盖;以及透镜模块，其粘附到所述基本平坦的顶部 透明封装层的表面覆盖发光二极管芯片。 在一个实施例中，透镜模块包括荧光层和覆盖或被荧光层覆盖的透镜。

公开(公告)号：US08153458B2

公开(公告)日：2012-04-10

申请号：US12407115

申请日：2009-03-19

申请人： Jui-Ping Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

发明人： Jui-Ping Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC分类号： H01L21/70 ,  H01L31/0232 ,  H01L31/14

CPC分类号： H01L27/14687 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/10 ,  H01L2924/00014 ,  Y10S257/911 ,  H01L2224/05599

摘要： Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.

摘要翻译： 提供了图像感测装置及其制造方法。 示例性图像感测装置包括具有彼此相对的第一侧和第二侧的第一基板。 在第一侧的第一基板中形成多个图像感测元件。 通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。 导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。 导电层位于第二侧的导电通孔上，并与导电焊盘电连接。 在导电层的一部分上形成导电凸块。 第二衬底在第一侧与第一衬底结合。

公开(公告)号：US07833810B2

公开(公告)日：2010-11-16

申请号：US12493758

申请日：2009-06-29

申请人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

发明人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

IPC分类号： H01L21/00 ,  H01L23/544

CPC分类号： H01L27/14618 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.

摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。 透明基板包括第一切削刃和第二切削刃。 具有裸片电路的CMOS图像传感器芯片安装在透明基板上。 密封剂设置在封装有CMOS图像传感器芯片的基板上。 连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。 隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。

公开(公告)号：US07829966B2

公开(公告)日：2010-11-09

申请号：US11944558

申请日：2007-11-23

申请人： Jui-Ping Weng ,  Tzu-Han Lin

发明人： Jui-Ping Weng ,  Tzu-Han Lin

IPC分类号： H01L31/0232

CPC分类号： H01L27/14627 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14685 ,  H04N5/2252 ,  H04N5/2257

摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

摘要翻译： 公开了一种用于图像传感器装置的电子组件。 电子组件包括安装在其上的封装模块和透镜组。 封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。 透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。 微透镜阵列设置在腔内。 导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。 还公开了一种用于制造电子组件的方法。

公开(公告)号：US07595220B2

公开(公告)日：2009-09-29

申请号：US11822011

申请日：2007-06-29

申请人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

发明人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/10

摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.

摘要翻译： 本发明提供一种图像传感器封装及其制造方法。 图像传感器封装包括其上包括传感器装置的第一基板和其中的孔。 包括第一开口的焊盘形成在第一基板的上表面上。 包括其中具有第二开口的间隔元件的第二基板设置在第一基板上。 导电插塞形成在孔中，并通过第一和第二开口到第二基板，以与接合焊盘电接触。 导电层形成在第一基板的下表面上并电连接到导电插塞。 在导电层上形成焊球，并通过导电插塞与焊盘电连接。 图像传感器封装还包括与第一基板结合的第二基板。 图像传感器封装相对较薄，因此其尺寸相对减小。

公开(公告)号：US07569409B2

公开(公告)日：2009-08-04

申请号：US11649242

申请日：2007-01-04

申请人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

发明人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

IPC分类号： H01L21/00 ,  H01L23/544

CPC分类号： H01L27/14618 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.

摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。 透明基板包括第一切削刃和第二切削刃。 具有裸片电路的CMOS图像传感器芯片安装在透明基板上。 密封剂设置在封装有CMOS图像传感器芯片的基板上。 连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。 隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。

公开(公告)号：US20090134483A1

公开(公告)日：2009-05-28

申请号：US11944558

申请日：2007-11-23

申请人： Jui-Ping Weng ,  Tzu-Han Lin

发明人： Jui-Ping Weng ,  Tzu-Han Lin

IPC分类号： H01L31/0232

CPC分类号： H01L27/14627 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14685 ,  H04N5/2252 ,  H04N5/2257

摘要： An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

摘要翻译： 公开了一种用于图像传感器装置的电子组件。 电子组件包括安装在其上的封装模块和透镜组。 封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。 透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。 微透镜阵列设置在腔内。 导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。 还公开了一种用于制造电子组件的方法。

公开(公告)号：US20090032893A1

公开(公告)日：2009-02-05

申请号：US11882441

申请日：2007-08-01

申请人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chung Peter Zung

发明人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chung Peter Zung

IPC分类号： H01L31/0203 ,  H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14683 ,  H01L21/304 ,  H01L21/76898 ,  H01L24/06 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2224/10

摘要： An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.

摘要翻译： 提供了一种图像传感器封装及其制造方法。 图像传感器封装包括其中包括通孔的第一基板，驱动电路和其上的第一导电焊盘。 包括其上的光敏器件和第二导电焊盘的第二衬底被结合到第一衬底，使得形成在第一衬底上的驱动电路可以电连接到并进一步控制形成在第二衬底上的光敏器件。 在第一基板的背面上形成焊球，并且电连接到用于传输来自驱动电路的信号的通孔。 由于感光装置和驱动电路分别制造在不同的基板上，所以其制造和设计更灵活。 此外，图像传感器封装相对较薄，因此其尺寸减小。