Abstract:
Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.
Abstract:
The present invention relates to a retaining structure for securing at least one expansion card (such as a Peripheral Component Interconnect, PCI card) on a motherboard. The retaining structure includes a frame member and a handle. The frame member has a main body, and the main body has at least one outer fixing portion and an inner fixing portion. The main body has a top piece and a connecting piece. The connecting piece is arranged away from the outer fixing portion and connected to the inner fixing portion. The handle is connected to the connecting piece. Upon mounting of the retaining structure, the distance between the handle and a base plate of a housing is less than the distance between the top piece and the base plate of the housing. This retaining structure may be easily dismounted in restricted space internal of the housing.
Abstract:
A display module includes a front frame, a rear housing, and a trimming board. The front frame includes a first positioning hole and a clamping hole. The rear housing includes a second positioning hole. The front frame is engaged with the rear housing. The second positioning hole communicates with the first positioning hole. The trimming board includes a bolt structure and a clamping structure. The bolt structure is adapted to pass through the first positioning hole and the second positioning hole for preventing the front frame from separated from the rear housing. The clamping hole is used for the clamping structure to pass through and prevent the clamping structure from separating from the clamping hole.
Abstract:
This invention proposes a new restructuring technique, Rewiring Using IRredundancy Removal and Addition (IRRA) used in the synthesis and optimization of logic designs. This method successfully removes any desired target wire by constructing a corresponding rectification network which exactly corrects the error of the circuit caused by the removal of the target wire. The rectification network can be further simplified to achieve excellent area optimization.
Abstract:
A method for recycling metals from swarf includes steps of removing oil in swarf by means of surfactant having a feature of strong hydrophilicity. The steps involves repeated stirring and washing, separating solid from liquid, and separating oil from water so as to force oil separate from the surface of solid, finishing all the steps in 10–30 minutes. Metals after finished the treatment may have only 1% of oil remained thereon, possible to be reused in metalworking. Oil and washing solution are also reusable after treated, so the method is effective both for treating waste and for recycling resources.
Abstract:
What-if simulation methods and systems are provided. A design coding in HDL (Hardware Description Language) and a simulation result corresponding to the design are provided. A what-if design scope and a what-if time window are received. A portion of the design is extracted from the design according to the what-if design scope, and primary input signals are determined during the extraction of the sub-design. Then, what-if simulation data is extracted from the simulation result according to the primary input signals and the what-if time window. A what-if test bench is generated according to the what-if simulation data, wherein the what-if simulation data is read, and the signal values are fed to a simulator according to the what-if test bench.
Abstract:
The present invention relates to a method for scanning a projective capacitive touch panel. The method includes the following steps: scanning the mutual capacitance that are divided into at least two groups by applying different frequency excitation signals to different mutual capacitance groups, wherein a frequency of a excitation signal applied to a mutual capacitance group with greater RC constant is lower than that of a excitation signal applied to a mutual capacitance group with smaller RC constant; obtaining a first current voltage of each mutual capacitance; comparing the first current voltage with a first reference voltage to obtain candidate mutual capacitance whose first current voltage exceed the first reference voltage by a first threshold value; scanning the candidate mutual capacitance by applying a low frequency excitation signal; obtaining a second current voltage of each candidate mutual capacitance; comparing the second current voltage of each candidate mutual capacitance with a corresponding second reference voltage to obtain touched mutual capacitance whose second current voltage exceed the corresponding second reference voltage by a second threshold value.
Abstract:
Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.
Abstract:
A portable electronic device includes a main body, a door and a latch. The main body includes a positioning concave area on a bottom surface thereof. The positioning concave area has a cutout at a first edge, and an inclined surface and a guide edge at an opposite edge. The door is detachably connected with the bottom surface of the main body. The latch is slidably connected with a through hole of the door. The latch has an engaging portion and a guiding portion at two opposite ends. When the door is assembled to the bottom surface of the main body, the engaging portion inserts into the cutout. When the door is taken apart from the bottom surface, the engaging portion is removed from the cutout, and the guiding portion slides along the guide edge to move the door along a direction perpendicular to a long axis of the latch.
Abstract:
A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.