The task of the present invention is to offer a conductive paste that can be molded into a conductive coating or film that can maintain flexibility and ductility even while possessing a thickness of 50 μm˜125 μm. The conductive paste of the present invention includes a conductive particulate, a metal capture agent and a polyimide precursor solution. The metal capture agent can be selected as at least one from among either pyrimidinethiol compounds, triazinethiol compounds and imidazole compounds with a mercapto group. Moreover, the conductive particulate is preferably a core particle that is covered with a metal shell. In addition, a polyamic acid solution is preferred as the polyimide precursor solution.