发明授权
US07999375B2 Electronic device with integrated micromechanical contacts and cooling system
失效
具有集成微机电触点和冷却系统的电子设备
- 专利标题： Electronic device with integrated micromechanical contacts and cooling system
- 专利标题（中）： 具有集成微机电触点和冷却系统的电子设备
-
申请号： US11548668申请日： 2006-10-11
-
公开(公告)号： US07999375B2公开(公告)日： 2011-08-16
- 发明人: Eric D. Hobbs , Gaetan L. Mathieu
- 申请人： Eric D. Hobbs , Gaetan L. Mathieu
- 申请人地址： US CA Livermore
- 专利权人： FormFactor, Inc.
- 当前专利权人： FormFactor, Inc.
- 当前专利权人地址： US CA Livermore
- 代理机构： Kirton & McConkie
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.