公开(公告)号：US07845072B2

公开(公告)日：2010-12-07

申请号：US12343260

申请日：2008-12-23

Applicant: Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

IPC: H05K3/30

CPC classification number: G01R31/2886 ,  G01R1/073 ,  G01R31/31905 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract translation: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。

公开(公告)号：US07732975B1

公开(公告)日：2010-06-08

申请号：US12345292

申请日：2008-12-29

Applicant: Eric D. Hobbs ,  Gaetan L. Mathieu

Inventor： Eric D. Hobbs ,  Gaetan L. Mathieu

IPC: H02N1/00

CPC classification number: H02N1/006

Abstract: A gap-closing actuator includes a stator having one or more first electrodes, a mover having one or more second electrodes interposed among the first electrodes, and a biasing mechanism for applying a non-capacitive bias to the mover for urging the mover to move in a desired direction with respect to the stator. The non-capacitive bias is different from a capacitive force generated between the first and second electrodes when the gap-closing actuator is in operation.

Abstract translation: 间隙关闭致动器包括具有一个或多个第一电极的定子，具有插入在第一电极中的一个或多个第二电极的移动器，以及用于向移动器施加非电容性偏压以推动移动器移动的偏置机构 相对于定子的期望方向。 当间隙关闭致动器运行时，非电容性偏压不同于在第一和第二电极之间产生的电容性力。

公开(公告)号：US07671614B2

公开(公告)日：2010-03-02

申请号：US11164737

申请日：2005-12-02

Applicant: Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum

Inventor： Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu ,  Makarand S. Shinde ,  Alexander H. Slocum

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R31/31905

Abstract: Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.

Abstract translation: 可以相对于探针卡组件的元件调整探针卡组件的探针，探针卡组件可以是探针卡组件的元件，其有助于将探针卡组件安装到测试装置。 然后可以将探针卡组件安装在测试装置中，并且可以相对于测试装置（例如测试装置的结构部分或连接到测试装置的结构元件）来调整探针卡组件的取向。

公开(公告)号：US20080231258A1

公开(公告)日：2008-09-25

申请号：US11690139

申请日：2007-03-23

Applicant: Eric D. Hobbs ,  Gaetan L. Mathieu

Inventor： Eric D. Hobbs ,  Gaetan L. Mathieu

IPC: G01R1/06

CPC classification number: G01R31/2889 ,  G01R1/07342

Abstract: A stiffening connector assembly and methods of use are provided herein. In some embodiments a stiffening connector assembly includes a connector configured to be coupled to a substrate; and a mechanism coupled to the connector and configured to restrict rotational movement of the connector with respect to the substrate when coupled thereto. The mechanism may further provide a lateral degree of freedom of movement in a direction substantially parallel to the substrate.

Abstract translation: 本文提供了加强连接器组件和使用方法。 在一些实施例中，加强连接器组件包括被配置为联接到基板的连接器; 以及耦合到所述连接器并且被配置为当连接到所述连接器时相对于所述基板限制所述连接器的旋转运动的机构。 该机构还可以在基本上平行于基底的方向上提供横向移动自由度。

公开(公告)号：US07999375B2

公开(公告)日：2011-08-16

申请号：US11548668

申请日：2006-10-11

Applicant: Eric D. Hobbs ,  Gaetan L. Mathieu

Inventor： Eric D. Hobbs ,  Gaetan L. Mathieu

IPC: H01L23/34

CPC classification number: H01L23/34 ,  B81B7/0006 ,  B81B7/0093 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00

Abstract: An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.

Abstract translation: 电子设备可以包括其上可以形成微机械系统的半导体管芯。 微机械系统可以包括多个导电细长的接触结构，其可以设置在半导体管芯的输入和/或输出端子上。 微机械系统还可以包括设置在半导体管芯上的冷却结构。

公开(公告)号：US20100164323A1

公开(公告)日：2010-07-01

申请号：US12345292

申请日：2008-12-29

Applicant: Eric D. Hobbs ,  Gaetan L. Mathieu

Inventor： Eric D. Hobbs ,  Gaetan L. Mathieu

IPC: H02N11/00

CPC classification number: H02N1/006

Abstract: A gap-closing actuator includes a stator having one or more first electrodes, a mover having one or more second electrodes interposed among the first electrodes, and a biasing mechanism for applying a non-capacitive bias to the mover for urging the mover to move in a desired direction with respect to the stator. The non-capacitive bias is different from a capacitive force generated between the first and second electrodes when the gap-closing actuator is in operation.

Abstract translation: 间隙关闭致动器包括具有一个或多个第一电极的定子，具有插入在第一电极中的一个或多个第二电极的移动器，以及用于向移动器施加非电容性偏压以推动移动器移动的偏置机构 相对于定子的期望方向。 当间隙关闭致动器运行时，非电容性偏压不同于在第一和第二电极之间产生的电容性力。

公开(公告)号：US20090079452A1

公开(公告)日：2009-03-26

申请号：US11861559

申请日：2007-09-26

Applicant: Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

IPC: G01R1/073 ,  G01R31/02 ,  H01L21/68

CPC classification number: G01R31/2891 ,  G01R1/06716 ,  G01R1/07342 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L21/682 ,  Y10T29/49002

Abstract: A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

Abstract translation: 用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。 该方法还可以包括在第一平面中约束相对于第二结构的第一结构，使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。 第二特征可以在通常平行于第一平面的第二平面中。 第一和第二结构可以是第一和第二电子部件，其可以是探针卡组件的部件。

公开(公告)号：US07471094B2

公开(公告)日：2008-12-30

申请号：US11165833

申请日：2005-06-24

Applicant: Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

IPC: G01R31/02

CPC classification number: G01R31/2886 ,  G01R1/073 ,  G01R31/31905 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract translation: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。

公开(公告)号：US08269514B2

公开(公告)日：2012-09-18

申请号：US12547454

申请日：2009-08-25

Applicant: Eric D. Hobbs ,  Gaetan L. Mathieu ,  Frank M. Zalar

Inventor： Eric D. Hobbs ,  Gaetan L. Mathieu ,  Frank M. Zalar

IPC: G01R31/20

CPC classification number: G01R1/06761 ,  G01R31/2863

Abstract: Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon.

Abstract translation: 本发明的实施例可以涉及用于其中的探针卡组件，多层支撑衬底以及设计用于探针卡组件的多层支撑衬底的方法。 在一些实施例中，探针卡组件可以包括被设计成基本匹配参考材料在所需温度范围内的热膨胀的多层支撑衬底; 以及耦合到多层支撑衬底的探针衬底。 在一些实施例中，参考材料可以是硅。

公开(公告)号：US07658831B2

公开(公告)日：2010-02-09

申请号：US11306291

申请日：2005-12-21

Applicant: Gaetan L. Mathieu ,  Treliant Fang ,  Eric D. Hobbs

Inventor： Gaetan L. Mathieu ,  Treliant Fang ,  Eric D. Hobbs

IPC: C25D5/02

CPC classification number: B81C1/0046 ,  B33Y10/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81C2201/0184 ,  B81C2201/0197 ,  C23C18/1608 ,  C23C18/1844 ,  C25D1/003 ,  C25D1/12 ,  C25D5/02 ,  G01R1/06755 ,  G01R3/00 ,  H01L21/288 ,  H01L21/76873 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1461 ,  H05K3/1275 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

Abstract translation: 公开了用于在三维阵列中沉积多个液滴的系统和方法。 阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。 可以将结构材料电沉积到种子层上以产生三维结构。