Provided are a high reliability stack module fabricated at low cost by using simplified processes, a card using the stack module, and a system using the stack module. In the stack module, unit substrates are stacked with respect to each other and each unit substrate includes a selection terminal. First selection lines are electrically connected to selection terminals of first unit substrates disposed in odd-number layers, pass through some of the unit substrates, and extend to a lowermost substrate of the unit substrates. Second selection lines are electrically connected to selection terminals of second unit substrates disposed in even-number layers, pass through some of the unit substrates, and extend to the lowermost substrate of the unit substrates. The selection terminal is disposed between the first selection lines and the second selection lines.