发明授权
US08011563B2 Compliant mold fill head with integrated cavity venting and solder cooling
有权
具有集成腔体排气和焊锡冷却的合适的模具填充头
- 专利标题： Compliant mold fill head with integrated cavity venting and solder cooling
- 专利标题（中）： 具有集成腔体排气和焊锡冷却的合适的模具填充头
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申请号： US11696753申请日： 2007-04-05
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公开(公告)号： US08011563B2公开(公告)日： 2011-09-06
- 发明人: Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
- 申请人： Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Ryan, Mason & Lewis, LLP
- 优先权： JP2006-104267 20060405; JP2006-104268 20060405
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; B23K37/00
摘要：
A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
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