发明授权
- 专利标题: Electroconductive bonding material and electric/electronic device using the same
- 专利标题(中): 导电接合材料和使用其的电气/电子设备
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申请号: US12870275申请日: 2010-08-27
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公开(公告)号: US08012379B2公开(公告)日: 2011-09-06
- 发明人: Hidenori Miyakawa , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
- 申请人: Hidenori Miyakawa , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
- 申请人地址: JP Osaka
- 专利权人: Panasonic Corporation
- 当前专利权人: Panasonic Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2005-082925 20050323
- 主分类号: H01B1/02
- IPC分类号: H01B1/02 ; B05D7/00
摘要:
A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.