发明授权
- 专利标题: Photoresist systems
- 专利标题(中): 光刻胶系统
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申请号: US10412640申请日: 2003-04-11
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公开(公告)号: US08012670B2公开(公告)日: 2011-09-06
- 发明人: Gary N. Taylor , Cheng-Bai Xu
- 申请人: Gary N. Taylor , Cheng-Bai Xu
- 申请人地址: US MA Marlborough
- 专利权人: Rohm and Haas Electronic Materials LLC
- 当前专利权人: Rohm and Haas Electronic Materials LLC
- 当前专利权人地址: US MA Marlborough
- 代理机构: The Dow Chemical Company
- 代理商 Peter F. Corless
- 主分类号: G03F7/20
- IPC分类号: G03F7/20 ; G03F7/11
摘要:
New photoresist systems are provided that comprise an underlying processing (or barrier) layer composition and an overcoated photoresist layer. Systems of the invention can exhibit significant adhesion to SiON and other inorganic surface layers.
公开/授权文献
- US20040029042A1 Photoresist systems 公开/授权日:2004-02-12
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