Invention Grant
- Patent Title: Random personalization of chips during fabrication
- Patent Title (中): 制造期间芯片的随机个性化
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Application No.: US12344725Application Date: 2008-12-29
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Publication No.: US08015514B2Publication Date: 2011-09-06
- Inventor: Mark D. Jaffe , Stephen A. Mongeon , Leah M. P. Pastel , Jed H. Rankin
- Applicant: Mark D. Jaffe , Stephen A. Mongeon , Leah M. P. Pastel , Jed H. Rankin
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb I.P. Law Firm, LLC
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Disclosed are embodiments of a method for randomly personalizing chips during fabrication, a personalized chip structure and a design structure for such a personalized chip structure. The embodiments use electronic device design and manufacturing processes to randomly or pseudo-randomly create a specific variation in one or more instances of a particular electronic device formed on each chip. The device design and manufacturing processes are tuned so that the specific variation occurs with some predetermined probability, resulting in a desired hardware distribution and personalizing each chip. The resulting personalized chips can be used for modal distribution of chips. For example, chips can be personalized to allow sorting when a single chip design can be used to support multiple applications. The resulting personalized chips can also be used for random number generation for creating unique on-chip identifiers, private keys, etc.
Public/Granted literature
- US20100164013A1 RANDOM PERSONALIZATION OF CHIPS DURING FABRICATION Public/Granted day:2010-07-01
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