Invention Grant
US08020750B2 Method of attaching components to fluid delivery systems using diffusion bonding
失效
使用扩散接合将部件附接到流体输送系统的方法
- Patent Title: Method of attaching components to fluid delivery systems using diffusion bonding
- Patent Title (中): 使用扩散接合将部件附接到流体输送系统的方法
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Application No.: US11586103Application Date: 2006-10-24
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Publication No.: US08020750B2Publication Date: 2011-09-20
- Inventor: Mark Crockett , John W. Lane , Micahel DeChellis , Chris Melcer , Erica Porras , Aneesh Khullar , Balarabe N. Mohammed
- Applicant: Mark Crockett , John W. Lane , Micahel DeChellis , Chris Melcer , Erica Porras , Aneesh Khullar , Balarabe N. Mohammed
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Shirley L. Church Esq.
- Main IPC: B23K20/00
- IPC: B23K20/00
Abstract:
A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and may be partially integrated or fully integrated into a processing chamber which also includes diffusion bonded layers.
Public/Granted literature
- US20070062021A1 Method of attaching components to semiconductor processing chambers using diffusion bonding Public/Granted day:2007-03-22
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