发明授权
- 专利标题: Sealing structure of vacuum device
- 专利标题(中): 真空装置密封结构
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申请号: US11951635申请日: 2007-12-06
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公开(公告)号: US08021488B2公开(公告)日: 2011-09-20
- 发明人: Keiichi Tanaka
- 申请人: Keiichi Tanaka
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2005-168231 20050608
- 主分类号: C23C16/00
- IPC分类号: C23C16/00
摘要:
A sealing structure for sealing a gap between a vacuum container 2 and a lid 3 contacted to an opening of the vacuum container 2 to close it. A cavity 66 is formed in an elastomer O-ring 64 interposed between the vacuum container 2 and the lid 3, and a cooling pipe 65 is inserted in the cavity 66. The O-ring is cooled by circulating coolant in the cooling pipe 65. Since permeability of gas in a solid depends on a temperature, the amount of gas permeating the O-ring 64, especially oxygen, can be reduced by cooling the O-ring 64, thus maintaining a vacuum level in the vacuum container 2 at a high level. Since the O-ring 64 is cooled from its inside, only the O-ring 64 can be cooled locally without influencing temperature controls at other parts of the vacuum device.
公开/授权文献
- US20080088097A1 SEALING STRUCTURE OF VACUUM DEVICE 公开/授权日:2008-04-17
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