发明授权
- 专利标题: System-in-a-package based flash memory card
- 专利标题(中): 基于系统的包装闪存卡
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申请号: US11133576申请日: 2005-05-19
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公开(公告)号: US08022519B2公开(公告)日: 2011-09-20
- 发明人: Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
- 申请人: Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
- 申请人地址: US TX Plano
- 专利权人: SanDisk Technologies Inc.
- 当前专利权人: SanDisk Technologies Inc.
- 当前专利权人地址: US TX Plano
- 代理机构: Vierra Magen Marcus & DeNiro LLP
- 主分类号: H01L23/02
- IPC分类号: H01L23/02
摘要:
A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
公开/授权文献
- US20060261454A1 System-in-a-package based flash memory card 公开/授权日:2006-11-23
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