发明授权
- 专利标题: Heating apparatus, coating and development apparatus, and heating method
- 专利标题(中): 加热装置,涂装开发装置和加热方法
-
申请号: US11378319申请日: 2006-03-20
-
公开(公告)号: US08025925B2公开(公告)日: 2011-09-27
- 发明人: Tetsuo Fukuoka , Takahiro Kitano , Nobuaki Matsuoka
- 申请人: Tetsuo Fukuoka , Takahiro Kitano , Nobuaki Matsuoka
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Smith, Gambrell & Russell, LLP
- 优先权: JP2005-088447 20050325
- 主分类号: B05D3/02
- IPC分类号: B05D3/02 ; H05B3/68 ; C23C16/00
摘要:
A heating apparatus is configured to include a hot plate at which a substrate is placed, a top plate opposed to the substrate, a gas discharging part provided on one end side of the hot plate for discharging gas between the hot plate and the top plate, an exhaust part provided to be opposed to the gas discharging part with the hot plate interposed therebetween, and a heating part independently heating a first region and a second region of the substrate. A heating process is performed with good within-wafer uniformity by forming an unidirectional flow to heat the first region and the second region at different temperatures.