利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US08026129B2 Stacked integrated circuits package system with passive components 有权
具有无源元件的堆叠式集成电路封装系统

Stacked integrated circuits package system with passive components
摘要：
A stacked integrated circuit package system is provided forming a first stack layer having a first integrated circuit die on a first substrate, forming a second stack layer having a second integrated circuit die on a second substrate, and mechanically and electrically connecting a spacer layer having a first passive component between the second stack layer and the first stack layer.
摘要（中）：

提供一种堆叠式集成电路封装系统，其形成在第一衬底上具有第一集成电路裸片的第一堆叠层，在第二衬底上形成具有第二集成电路裸片的第二堆叠层，以及机械地和电连接具有 第二堆叠层和第一堆叠层之间的第一无源部件。

公开/授权文献
信息查询
Espacenet
0/0