发明授权
- 专利标题： Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure
- 专利标题（中）： 电路连接用粘接剂，使用电路连接方法，电路连接结构
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申请号： US12847819申请日： 2010-07-30
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公开(公告)号： US08029911B2公开(公告)日： 2011-10-04
- 发明人: Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
- 申请人： Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2000-128936 20000425; JP2000-128937 20000425
- 主分类号： H05K3/32
- IPC分类号： H05K3/32 ; H05K1/14 ; H01L21/60 ; H01L21/50 ; C09J7/00
摘要：
There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.
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