公开(公告)号：US08029911B2

公开(公告)日：2011-10-04

申请号：US12847819

申请日：2010-07-30

申请人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

发明人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC分类号： H05K3/32 ,  H05K1/14 ,  H01L21/60 ,  H01L21/50 ,  C09J7/00

CPC分类号： C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US20100294551A1

公开(公告)日：2010-11-25

申请号：US12847819

申请日：2010-07-30

申请人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

发明人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC分类号： H05K1/02 ,  B32B7/10 ,  B32B37/14

CPC分类号： C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US06762249B1

公开(公告)日：2004-07-13

申请号：US10069053

申请日：2002-07-08

申请人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

发明人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

IPC分类号： C08G1862

CPC分类号： H05K3/323 ,  C08F283/006 ,  C08F290/067 ,  C08G18/4018 ,  C08G18/4238 ,  C08G18/4277 ,  C08G18/4854 ,  C08G18/6607 ,  C08G18/672 ,  C08G18/8175 ,  C08L51/08 ,  C08L75/04 ,  C09J4/06 ,  H01L24/29 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/0154 ,  C08G18/42 ,  C08L2666/02 ,  H01L2924/00

摘要： The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

摘要翻译： 本发明提供一种配线连接材料，其包含2至75重量份的聚氨酯树脂，30至60重量份的可自由基聚合的物质和0.1至30重量份的能产生 加热时的自由基，以及使用配线连接材料制造配线连接板的工序。 本发明的配线连接材料优选还可以含有成膜材料和/或导电性粒子。

公开(公告)号：US20060252843A1

公开(公告)日：2006-11-09

申请号：US11485295

申请日：2006-07-13

申请人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

发明人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

IPC分类号： C08G18/81 ,  C08G18/67

CPC分类号： H05K3/323 ,  C08F283/006 ,  C08F290/067 ,  C08G18/4018 ,  C08G18/4238 ,  C08G18/4277 ,  C08G18/4854 ,  C08G18/6607 ,  C08G18/672 ,  C08G18/8175 ,  C08L51/08 ,  C08L75/04 ,  C09J4/06 ,  H01L24/29 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/0154 ,  C08G18/42 ,  C08L2666/02 ,  H01L2924/00

摘要： The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

公开(公告)号：US20070166549A1

公开(公告)日：2007-07-19

申请号：US11723644

申请日：2007-03-21

申请人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

发明人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC分类号： B32B27/00 ,  B32B9/04

CPC分类号： C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US07208105B2

公开(公告)日：2007-04-24

申请号：US10258548

申请日：2001-04-25

申请人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

发明人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC分类号： H01B1/12 ,  H01B1/22 ,  H01L23/14

CPC分类号： C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US20100265685A1

公开(公告)日：2010-10-21

申请号：US12824709

申请日：2010-06-28

申请人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

发明人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

IPC分类号： H05K1/14 ,  H05K3/00

CPC分类号： H05K3/323 ,  C08F283/006 ,  C08F290/067 ,  C08G18/4018 ,  C08G18/4238 ,  C08G18/4277 ,  C08G18/4854 ,  C08G18/6607 ,  C08G18/672 ,  C08G18/8175 ,  C08L51/08 ,  C08L75/04 ,  C09J4/06 ,  H01L24/29 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/0154 ,  C08G18/42 ,  C08L2666/02 ,  H01L2924/00

摘要： The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

摘要翻译： 本发明提供一种配线连接材料，其包含2至75重量份的聚氨酯树脂，30至60重量份的可自由基聚合的物质和0.1至30重量份的能产生 加热时的自由基，以及使用配线连接材料制造配线连接板的工序。 本发明的配线连接材料优选还可以含有成膜材料和/或导电性粒子。

公开(公告)号：US07141645B2

公开(公告)日：2006-11-28

申请号：US10846507

申请日：2004-05-17

申请人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

发明人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

IPC分类号： C08F283/04

CPC分类号： H05K3/323 ,  C08F283/006 ,  C08F290/067 ,  C08G18/4018 ,  C08G18/4238 ,  C08G18/4277 ,  C08G18/4854 ,  C08G18/6607 ,  C08G18/672 ,  C08G18/8175 ,  C08L51/08 ,  C08L75/04 ,  C09J4/06 ,  H01L24/29 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/0154 ,  C08G18/42 ,  C08L2666/02 ,  H01L2924/00

摘要： The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

摘要翻译： 本发明提供一种配线连接材料，其包含2至75重量份的聚氨酯树脂，30至60重量份的可自由基聚合的物质和0.1至30重量份的能产生 加热时的自由基，以及使用配线连接材料制造配线连接板的工序。 本发明的配线连接材料优选还可以含有成膜材料和/或导电性粒子。

公开(公告)号：US09817345B2

公开(公告)日：2017-11-14

申请号：US15352782

申请日：2016-11-16

申请人： Motoyoshi Yamano ,  Tetsuo Tokuda ,  Yoshikuni Sasaki ,  Hiroshi Ono ,  Hironori Yamaoka ,  Ryohhei Sugiyama ,  Kohichi Utsunomiya ,  Arinobu Yoshiura ,  Hideo Nagafuji

发明人： Motoyoshi Yamano ,  Tetsuo Tokuda ,  Yoshikuni Sasaki ,  Hiroshi Ono ,  Hironori Yamaoka ,  Ryohhei Sugiyama ,  Kohichi Utsunomiya ,  Arinobu Yoshiura ,  Hideo Nagafuji

IPC分类号： G03G15/20

CPC分类号： G03G15/2039 ,  G03G15/2032 ,  G03G15/2064

摘要： A fixing device includes a heater, a fixing rotator, a pressure rotator to press against the fixing rotator to form a fixing nip between the fixing rotator and the pressure rotator, through which a recording medium is conveyed, a moving device to move the pressure rotator in directions in which the pressure rotator comes into contact with and separates from the fixing rotator, a thermal expansion amount predictor to predict an amount of thermal expansion of the fixing rotator while the recording medium is conveyed, and a nip width adjuster to control a moving distance of the pressure rotator moved by the moving device toward the fixing rotator, depending on the amount of thermal expansion of the fixing rotator predicted by the thermal expansion amount predictor, so as to adjust a width of the fixing nip to maintain a substantially constant width of the fixing nip.

公开(公告)号：US09557693B2

公开(公告)日：2017-01-31

申请号：US14626168

申请日：2015-02-19

申请人： Hiroshi Ono

发明人： Hiroshi Ono

IPC分类号： G03G15/20

CPC分类号： G03G15/206 ,  G03G15/2028 ,  G03G15/2057 ,  G03G2215/2048

摘要： A fixing device includes a heating rotator and a pressure rotator pressed against the heating rotator to form a fixing nip therebetween, through which a recording medium bearing a toner image is conveyed. A plurality of first recesses is scattered on a circumferential face of the heating rotator. A plurality of second recesses is scattered on a circumferential face of the pressure rotator. Each of the second recesses is greater than each of the first recesses.

摘要翻译： 定影装置包括加热旋转器和压在加热旋转器上的压力旋转器，以在其间形成定影辊隙，通过该定影夹持器传送带有调色剂图像的记录介质。 多个第一凹部散布在加热旋转体的周面上。 多个第二凹部散布在压力旋转体的圆周面上。 每个第二凹部大于每个第一凹部。