发明授权
- 专利标题: Patch package structure
- 专利标题(中): 贴片包装结构
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申请号: US12314564申请日: 2008-12-12
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公开(公告)号: US08033395B2公开(公告)日: 2011-10-11
- 发明人: Yoshihiro Iwao , Akinori Hanatani , Junichi Sekiya , Hitoshi Akemi
- 申请人: Yoshihiro Iwao , Akinori Hanatani , Junichi Sekiya , Hitoshi Akemi
- 申请人地址: JP Osaka JP Kyoto
- 专利权人: Nitto Denko Corporation,Sasaki Chemical Co., Ltd.
- 当前专利权人: Nitto Denko Corporation,Sasaki Chemical Co., Ltd.
- 当前专利权人地址: JP Osaka JP Kyoto
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2007-323890 20071214
- 主分类号: A61B19/02
- IPC分类号: A61B19/02 ; B65D73/00 ; B65D65/26
摘要:
The main object of the present invention is to provide a patch package structure including a patch containing a physiologically active ingredient and a package housing the patch, which is capable of stably retaining the physiologically active ingredient in the patch during preservation. This object can be achieved by employing the following constitution.To be specific, the present invention is a patch package structure including a patch 1 having an adhesive layer containing an organic liquid component, and a packaging member 51 housing the patch, wherein the packaging member 51 includes a first package 11, the first package 11 including an acrylonitrile resin layer 12, a moisture-absorbing layer 13 formed on the acrylonitrile resin layer 12, and a moisture impermeable layer 14 formed on the moisture-absorbing layer 13, and the acrylonitrile resin layer 12 is provided on the proximal side of the patch 1.
公开/授权文献
- US20090166229A1 Patch package structure 公开/授权日:2009-07-02
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