发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US12968534申请日： 2010-12-15
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公开(公告)号： US08035222B2公开(公告)日： 2011-10-11
- 发明人: Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
- 申请人： Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
- 申请人地址： JP Kawasaki-shi
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Kawasaki-shi
- 代理机构： Brundidge & Stanger, P.C.
- 优先权： JP2009-140454 20090611
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
公开/授权文献
- US20110084359A1 SEMICONDUCTOR DEVICE 公开/授权日：2011-04-14
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