Invention Grant
- Patent Title: Passive components in the back end of integrated circuits
- Patent Title (中): 集成电路后端的被动元件
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Application No.: US12849086Application Date: 2010-08-03
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Publication No.: US08039354B2Publication Date: 2011-10-18
- Inventor: Anil K. Chinthakindi , Douglas D. Coolbaugh , Ebenezer E. Eshun , Zhong-Xiang He , Jeffrey B. Johnson , Jonghae Kim , Jean-Oliver Plouchart , Anthony K. Stamper
- Applicant: Anil K. Chinthakindi , Douglas D. Coolbaugh , Ebenezer E. Eshun , Zhong-Xiang He , Jeffrey B. Johnson , Jonghae Kim , Jean-Oliver Plouchart , Anthony K. Stamper
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Anthony J. Canale
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
Passive components are formed in the back end by using the same deposition process and materials as in the rest of the back end. Resistors are formed by connecting in series individual structures on the nth, (n+1)th, etc levels of the back end. Capacitors are formed by constructing a set of vertical capacitor plates from a plurality of levels in the back end, the plates being formed by connecting electrodes on two or more levels of the back end by vertical connection members.
Public/Granted literature
- US20100297825A1 Passive Components in the Back End of Integrated Circuits Public/Granted day:2010-11-25
Information query
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