发明授权
- 专利标题: Semiconductor device built on plastic substrate
- 专利标题(中): 半导体器件内置塑料基板
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申请号: US10885959申请日: 2004-07-07
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公开(公告)号: US08044387B1公开(公告)日: 2011-10-25
- 发明人: Matthew S. Buynoski , Uzodinma Okoroanyanwu , Suzette K. Pangrle , Nicholas H. Tripsas
- 申请人: Matthew S. Buynoski , Uzodinma Okoroanyanwu , Suzette K. Pangrle , Nicholas H. Tripsas
- 申请人地址: US CA Sunnyvale
- 专利权人: Spansion LLC
- 当前专利权人: Spansion LLC
- 当前专利权人地址: US CA Sunnyvale
- 代理机构: Turocy & Watson, LLP
- 主分类号: H01L35/24
- IPC分类号: H01L35/24
摘要:
Disclosed are semiconductor memory devices containing a plastic substrate and at least one active device supported by the plastic substrate, the active device containing an organic semiconductor material. The semiconductor memory devices containing a plastic substrate may further contain a polymer dielectric and/or a conductive polymer.
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