Invention Grant
US08046860B2 System and method for removing particles in semiconductor manufacturing
有权
用于去除半导体制造中的颗粒的系统和方法
- Patent Title: System and method for removing particles in semiconductor manufacturing
- Patent Title (中): 用于去除半导体制造中的颗粒的系统和方法
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Application No.: US12885630Application Date: 2010-09-20
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Publication No.: US08046860B2Publication Date: 2011-11-01
- Inventor: Chen-Yuan Hsia , Chang-Cheng Hung , Chi-Lun Lu , Shih-Ming Chang , Wen-Chuan Wang , Yen-Bin Huang , Ching-Yu Chang , Chin-Hsiang Lin
- Applicant: Chen-Yuan Hsia , Chang-Cheng Hung , Chi-Lun Lu , Shih-Ming Chang , Wen-Chuan Wang , Yen-Bin Huang , Ching-Yu Chang , Chin-Hsiang Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: A47L13/40
- IPC: A47L13/40
Abstract:
A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
Public/Granted literature
- US20110005010A1 SYSTEM AND METHOD FOR REMOVING PARTICLES IN SEMICONDUCTOR MANUFACTURING Public/Granted day:2011-01-13
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