发明授权
- 专利标题： Chip holder with wafer level redistribution layer
- 专利标题（中）： 具有晶片级再分布层的芯片保持架
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申请号： US11675984申请日： 2007-02-16
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公开(公告)号： US08049323B2公开(公告)日： 2011-11-01
- 发明人: Chen-Shien Chen , Chao-Hsiang Yang , Jimmy Liang , Han-Liang Tseng , Mirng-Ji Lii , Tjandra Winata Karta , Hua-Shu Wu
- 申请人： Chen-Shien Chen , Chao-Hsiang Yang , Jimmy Liang , Han-Liang Tseng , Mirng-Ji Lii , Tjandra Winata Karta , Hua-Shu Wu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Duane Morris LLP
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/60
摘要：
A chip holder formed of silicon, glass, other ceramics or other suitable materials includes a plurality of recesses for retaining semiconductor chips. The bond pads of the semiconductor chip are formed on or over an area of the chip holder that surrounds the semiconductor chip thus expanding the bonding area. The bond pads are coupled, using semiconductor wafer processing techniques, to internal bond pads formed directly on the semiconductor chip.
公开/授权文献
- US20080197473A1 CHIP HOLDER WITH WAFER LEVEL REDISTRIBUTION LAYER 公开/授权日：2008-08-21
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