Invention Grant
- Patent Title: Printed circuit board and manufacturing method thereof
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US12314450Application Date: 2008-12-10
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Publication No.: US08056220B2Publication Date: 2011-11-15
- Inventor: Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
- Applicant: Sang-Hoon Kim , Je-Gwang Yoo , Joon-Sung Kim , Han Seo Cho
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0115391 20061121
- Main IPC: H05K3/00
- IPC: H05K3/00 ; G02B6/12

Abstract:
A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.
Public/Granted literature
- US20090100671A1 Printed circuit board and manufacturing method thereof Public/Granted day:2009-04-23
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