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    PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME 有权
    用于光波导的印刷电路板及其制造方法

    公开(公告)号：US20120171624A1

    公开(公告)日：2012-07-05

    申请号：US13419826

    申请日：2012-03-14

    申请人： Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

    发明人： Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

    IPC分类号： G03F7/20

    CPC分类号： G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

    摘要： Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

    摘要翻译： 这里公开了一种用于光波导的印刷电路板，包括基板和形成在基板上的光波导。 光波导包括形成在基板上的下包层，形成在下包层上并具有芯形成通孔的绝缘层，形成在下包层的区域上的芯部，其暴露于 所述通孔和形成在所述通孔中和所述绝缘层上的上覆层。

    Printed circuit board and manufacturing method thereof
    4.
    发明授权
    Printed circuit board and manufacturing method thereof 有权
    印刷电路板及其制造方法

    公开(公告)号：US08056220B2

    公开(公告)日：2011-11-15

    申请号：US12314450

    申请日：2008-12-10

    申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

    发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

    IPC分类号： H05K3/00 ,  G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

    摘要翻译： 公开了印刷电路板。 一种印刷电路板，包括第一板部分，柔性板部分，其一侧与第一板部分耦合并且包括电布线层和光波导以传输电信号和光信号;以及第二板 与柔性基板部分的另一侧耦合的部分，其中电布线层和光波导在其间具有间隙设置，可以通过使光波导和电布线层间隔开来提供更大的弯曲性和可靠性 在板的柔性部分之间，通过使光波导分别制造，然后在板的制造过程中插入，可以以更高的精度制造光波导以获得更高的可靠性。

    OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
    光接线板及其制造方法

    公开(公告)号：US20110103737A1

    公开(公告)日：2011-05-05

    申请号：US12761752

    申请日：2010-04-16

    申请人： Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Sang-Hoon Kim

    发明人： Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Sang-Hoon Kim

    IPC分类号： G02B6/12 ,  B32B37/00

    CPC分类号： G02B6/138 ,  B32B38/06 ,  B32B2038/047 ,  B32B2457/08 ,  G02B6/1221 ,  H05K1/0274

    摘要： An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a through-hole formed therein and the through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, forming a second clad layer by filling a second clad substance in the through-hole, in which the second clad layer covers the core unit, and stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer covers the second clad layer.

    摘要翻译： 公开了一种光布线板及其制造方法。 根据本发明的一个实施例，该方法包括提供其中形成有布线槽的基底基板，通过在布线槽中填充第一包层物质形成第一覆盖层，在基底基板上堆叠中间绝缘层， 其中中间绝缘层具有形成在其中的通孔，并且通孔对应于布线槽，在第一包层上形成芯单元，通过在通孔中填充第二包层物质形成第二包层 其中第二覆盖层覆盖芯单元，并且在覆盖绝缘层覆盖第二覆层的中间绝缘层上堆叠覆盖绝缘层。

    Printed circuit board
    7.
    发明申请
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：US20110007999A1

    公开(公告)日：2011-01-13

    申请号：US12923143

    申请日：2010-09-03

    申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

    发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

    摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

    摘要翻译： 一种印刷电路板，包括具有电路图案的第一光波导和埋在其一侧的焊盘，堆叠在所述第一光波导的一侧上的第一绝缘层，堆叠在所述第一绝缘层上的第一绝缘材料， 布线层堆叠在第一绝缘材料上，具有电路图案和埋在其一侧的焊盘的第二光波导，堆叠在第二光波导的一侧上的第二绝缘层，堆叠在第二绝缘层上的第二绝缘材料 层叠在所述第二绝缘材料上的第二电布线层，插入在所述第一光波导的另一侧和所述第二光波导的另一侧之间的中间层，使得附接所述第一光波导和所述第二光波导;以及 穿过第一光波导和第二光波导的通孔。

    Method of manufacturing printed circuit board
    9.
    发明申请
    Method of manufacturing printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号：US20090223044A1

    公开(公告)日：2009-09-10

    申请号：US12453616

    申请日：2009-05-15

    申请人： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

    发明人： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

    IPC分类号： H05K3/10

    CPC分类号： G02B6/1221 ,  G02B6/136 ,  G02B6/28 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/20 ,  Y10T29/49155

    摘要： A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

    摘要翻译： 一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电 信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

    Substrate manufacturing method
    10.
    发明申请
    Substrate manufacturing method 审中-公开
    基板制造方法

    公开(公告)号：US20090084494A1

    公开(公告)日：2009-04-02

    申请号：US12007475

    申请日：2008-01-10

    申请人： Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

    发明人： Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

    IPC分类号： B29C65/00

    CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68318 ,  H01L2221/68345 ,  H05K3/0052 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/20 ,  H05K3/4682 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0228 ,  H05K2203/0384 ,  Y10T156/1052

    摘要： A substrate manufacturing method is disclosed. A substrate manufacturing method, comprising: providing a support body on which a first separation layer is formed; forming a second separation layer on the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming a circuit stack body on the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer, provides easy separation of the circuit stack pattern, which formed on the support body, from the support body and reduced manufacturing cost by reducing number of process and required materials for manufacturing coreless thin substrate.

    摘要翻译： 公开了一种基板制造方法。 一种基板制造方法，包括：提供其上形成有第一分离层的支撑体; 在所述第一分离层上形成第二分离层; 形成覆盖所述第一分离层和所述第二分离层的粘合层; 在所述粘合层上形成电路堆叠体; 将电路堆叠体，粘合层和第二分离层切割成预定形状; 并且通过将第二层与第一层分开来形成电路堆叠单元，使形成在支撑体上的电路堆叠图形容易地从支撑体分离，并通过减少工艺数量和所需的制造材料来减少制造成本 无芯薄基板。