A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrate. Then, a prepreg and a heat dissipating metal layer are provided, and the heat dissipating metal layer is disposed on a first surface of the prepreg and a second surface of the prepreg faces toward the chip. Finally, the prepreg covers the chip by laminating the prepreg and the substrate.