发明授权
- 专利标题: Sintered silicon oxide for film vapor deposition, its production method, and method for producing silicon oxide vapor deposition film
- 专利标题(中): 用于薄膜气相沉积的烧结氧化硅,其制造方法和氧化硅蒸镀膜的制造方法
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申请号: US13040838申请日: 2011-03-04
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公开(公告)号: US08066806B2公开(公告)日: 2011-11-29
- 发明人: Hirofumi Fukuoka , Meguru Kashida , Toshio Ohba
- 申请人: Hirofumi Fukuoka , Meguru Kashida , Toshio Ohba
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier Neustadt, L.L.P.
- 优先权: JP2008-062071 20080312
- 主分类号: C01B33/113
- IPC分类号: C01B33/113 ; C23C16/40
摘要:
A sintered silicon oxide for film vapor deposition having a density of 1.0 to 2.0 g/cm3, three-point flexural strength of at least 50 g/mm2, and a BET specific surface area of 0.1 to 20 m2/g is provided. When this sintered silicon oxide is used for evaporation source of a film, pin holes and other defects of the film caused by the problematic splash phenomenon can be reliably prevented and stable production of a reliable package material having excellent gas barrier property is been enabled. This invention also provides a method for producing such sintered silicon oxide, and this method can be used in a large scale production without requiring any special technology, and therefore, this method is capable of supplying the market with the sintered silicon oxide at reduced cost.
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