Invention Grant
- Patent Title: Surface emitting laser and manufacturing method therefor
- Patent Title (中): 表面发射激光器及其制造方法
-
Application No.: US12979472Application Date: 2010-12-28
-
Publication No.: US08073032B2Publication Date: 2011-12-06
- Inventor: Mitsuhiro Ikuta
- Applicant: Mitsuhiro Ikuta
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2008-247737 20080926
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
Provided is a surface emitting laser or the like capable of suppressing horizontal misalignment between the surface relief structure and the current confining structure to make higher the precision of the alignment, to thereby obtain single transverse mode characteristics with stability. The surface emitting laser having a semiconductor layer laminated therein includes: a first etching region formed by etching a part of the upper mirror; and a second etching region formed by performing etching from a bottom portion of the first etching region to a semiconductor layer for forming a current confining structure, in which a depth of the second etching region is smaller than a depth of the first etching region.
Public/Granted literature
- US20110090929A1 SURFACE EMITTING LASER AND MANUFACTURING METHOD THEREFOR Public/Granted day:2011-04-21
Information query