Invention Grant
- Patent Title: Coextrudable hot-melt adhesive
- Patent Title (中): 可共挤出热熔胶
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Application No.: US12813694Application Date: 2010-06-11
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Publication No.: US08076422B2Publication Date: 2011-12-13
- Inventor: Marcus Heemann , Eckhard Pürkner , Volker Erb , Maja Schroeder , Dirk Vianden
- Applicant: Marcus Heemann , Eckhard Pürkner , Volker Erb , Maja Schroeder , Dirk Vianden
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent David P. LeCroy
- Priority: DE102007060533 20071213
- Main IPC: C08L23/16
- IPC: C08L23/16 ; C08K5/01

Abstract:
A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-α-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.
Public/Granted literature
- US20100256274A1 Coextrudable Hot-Melt Adhesive Public/Granted day:2010-10-07
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