发明授权
- 专利标题： Laser irradiation apparatus, laser irradiation method, fabrication method for thin film semiconductor device and fabrication method for display apparatus
- 专利标题（中）： 激光照射装置，激光照射方法，薄膜半导体装置的制造方法以及显示装置的制造方法
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申请号： US11844502申请日： 2007-08-24
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公开(公告)号： US08084707B2公开(公告)日： 2011-12-27
- 发明人: Keisuke Omoto , Minoru Nakajima , Masatoshi Inagaki
- 申请人： Keisuke Omoto , Minoru Nakajima , Masatoshi Inagaki
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： SNR Denton US LLP
- 优先权： JP2006-231506 20060829
- 主分类号： B23K26/00
- IPC分类号： B23K26/00
摘要：
Disclosed herein is a laser irradiation apparatus, including: an optical system configured to form laser light of a linear cross section to be irradiated on an irradiation object; and a cutting member having a light blocking portion configured to block the laser light formed in the linear cross section by the optical system to cut the laser light so as to have a predetermined length along a line longitudinal direction; the light blocking portion having a plurality of fins provided on the light blocking portion thereof so as to fetch and absorb the laser light.
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